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IEC 60286-3-2007
Packaging of components for automatic handling. Part 3:Packaging of surface mount components on continuous tapes Emballage de composants pour opérations automatisées. Partie 3:Emballage des composants appropriés au montage en surface en bandes continues Edition 4.0
适用范围：This part of IEC 60286 is applicable to the (ape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
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