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IEC 61191-2-2013

印制电路板组件 第2部分:分规范 表面安装焊接组件的要求

Printed board assemblies. Part 2:Sectional specification. Requirements for surface mount soldered assemblies

发布日期: 2013-06-05

实施日期: 2013-06-05

ICS分类号: 31.190 - 电子学 - ; 31.240 - 电子设备用机械构件

标准组织: IEC - 国际电工委员会标准

全文来源: WF

英文关键词: Electrical engineering Electronic Electronic equipment and components Electronically-operated devices Lead free Paste solder Printed circuits Printed-circuit boards Sectional specification SMD Soldered Soldered joints Specification Specification (approval) Surface mounting

语种: 汉语

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