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IEC 62047-10-2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
适用范围：IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.
发布日期： 2011-07-26
实施日期： 2011-07-26
发布单位： IX-IEC
ICS分类号： 31.080.99 - 电子学 - 其他半导体器件
标准组织： IEC - 国际电工委员会标准
全文来源： WF
英文关键词： Compression Compression stresses Compression tests Electrical engineering Materials Microelectronics Microsystem techniques Pressure tests Properties Samples Semiconductor devices System engineering Tensile strain Tensile testing Testing Testing devices Testing system Thin films Thin-film devices Thin-film technology
语种： 汉语
页数： 22
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