半导体器件微电机器件第12部分:用微电机系统结构谐振进行薄膜材料的弯曲疲劳试验方法

IEC 62047-12-2011

半导体器件微电机器件第12部分:用微电机系统结构谐振进行薄膜材料的弯曲疲劳试验方法

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

添加收藏

导出文件

适用范围：IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 μm to 1 000 μm in the plane direction and from 1 μm to 100 μm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 μm and 10 μm in thickness. The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.

发布日期： 2011-09-13

实施日期： 2011-09-13

ICS分类号： 31.080.99 - 电子学 - 其他半导体器件

标准组织： IEC - 国际电工委员会标准

全文来源： WF

英文关键词： Definitions Electrical engineering Fatigue Fatigue limit Materials Microelectronics Microsystem techniques Samples Semiconductor devices System engineering Testing Testing devices Testing system Thin-film technology

语种：汉语

页数： 59

查看标准

半导体器件 微电机器件 第12部分:用微电机系统结构谐振进行薄膜材料的弯曲疲劳试验方法

主题相关

标准解读

半导体器件微电机器件第12部分:用微电机系统结构谐振进行薄膜材料的弯曲疲劳试验方法