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IEC 62047-14-2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
适用范围：IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.
发布日期： 2012-02-28
实施日期： 2012-02-28
发布单位： IX-IEC
ICS分类号： 31.080.99 - 电子学 - 其他半导体器件
标准组织： IEC - 国际电工委员会标准
全文来源： WF
英文关键词： Definitions Electrical engineering Form changes Forming forces Forming method Material behaviour Materials Metal films Metallic Microelectronics Microsystem techniques Properties Semiconductor devices System engineering Testing Thickness Thin films Thin-film technology
语种： 汉语
页数： 34
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