Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
Blank detail specification: case-rated rectifier diodes; German version EN 150009:1991
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003)
实施日期:2003-09-01
Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
实施日期:2000-06-10
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
发布日期:2002-04-12 实施日期:2002-04-12
Detail specification for N channel junction pair field-effect transistors,Type CS25 ...
实施日期:1982-07-01
Detail specification for electronic components high-frequency amplification transistor for silicon NPN ambient-rated for type 3DG 2636
实施日期:1997-01-01
Semiconductor optoelectronic devices-Blank detail specification for lower-power light-emitting diodes
发布日期:2009-11-17 实施日期:2010-01-01
Harmonised system of quality assessment for electronic components. Blank detail specification : case-rated bipolar transistors for low frequency application.
Methods of measurement for dynamic impedance of silicon current regulator diodes ...
实施日期:1983-01-01
Semiconductor discrete device--Detail specification for type FH129 NPN silicon power Darlington transistor
发布日期:1994-09-30 实施日期:1994-12-01
Method of test for reliability assured bi-directional triode thyristors -- remanent current
发布日期:1983-01-12 实施日期:1988-12-15
Organic light emitting diode (OLED) displays - Part 61: Measuring methods of optical and electro-optical parameters
发布日期:2013-12-17 实施日期:2014-05-15
Static var compensators (SVC) - Testing of thyristor valves
发布日期:2011-04-21 实施日期:2011-04-21
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
实施日期:2005-04-01
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