Semiconductor die products - Part 7: XML schema for data exchange
适用范围:This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structure...
发布日期:2007-08-23 实施日期:2007-08-23
Detail specification for silicon NPN epitaxial planar low-frequency high power transistors,Type 3DD53 and 3DD54 ...
实施日期:1974-10-01
Backlight units for liquid crystal displays-Part 3-1:LED backlight unit for portable display-Blank detail specification
适用范围:本部分规定了便携式显示用LED背光组件的技术要求、质量评定程序、检验和试验方法、包装、运输和储存的空白详细要求。 本部分适用于便携式显示用LED背光组件(以下简称“组件”)。
发布日期:2014-10-14 实施日期:2015-04-01
Detail specification for silicon PNP epitaxial planar low power switching transistors,Type 3CK121 ...
实施日期:1982-05-01
Semiconductor die products Part 1:Requirements for procurement and use First Edition
发布日期:2005-08-30 实施日期:2005-08-01
Blank detail specification - Current regulator and current reference diodes; German version EN 150013:1991
Detail specification for N channel junction field-effect low power switching transistors,Type CS45 ...
实施日期:1982-12-01
Standard Test Procedured for Noise Margin Measurements for Semiconductor Logic Gating Microcircuits
发布日期:1980-12-30 实施日期:1980-12-30
Detail specification for silicon NPN epitaxial planar superhigh frequency low power transistors,Type 3DG72 ...
实施日期:1983-10-01
Semiconductor discrete device--Detail specification for silicon NPN low power switching transistor of Type 3DK101
适用范围:本规范规定了3DK101型NPN硅小功率开关晶体管的详细要求。每种器件按GJB 33《半导体分立器件总规范》的规定,提供产品保证的三个等级(GP、GT、和GCT级)。
发布日期:1992-11-19 实施日期:1993-05-01
Test specification of high temperature reverse bias for press pack insulated-gate bipolar transistor modules
发布日期:2021-09-28 实施日期:2021-09-30
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