BS EN 60512-12-7-2001

电子设备连接器 试验和测量 第12-7部分:锡焊试验 试验12g:易焊性,润湿平衡方法 IEC 60512-12-7:2001

Steckverbinder fuer elektronische Einrichtungen. Mess-und Pruefverfahren. Pruefungen der Loetbarkeit. Pruefung 12g. Loetbarkeit,Loetwaage-Verfahren Connectors for Electronic Equipment-Tests and Measure...

适用范围：This part of IEC 60512, when required by the detail specification, is to be used for testing connectors within the scope of IEC technical committee 48. This test may also be used for similar components...

实施日期：2001-09-15

BS EN ISO 14171-2010

Welding consumables. Solid wire electrodes, tubular cored electrodes and electrode/flux combinations for submerged arc welding of non alloy and fine grain steels. Classification

实施日期：2010-10-31

DIN EN 61190-1-1-2003

电子组件连接材料 第1-1部分:电子装配高级互连接用软钎焊助剂的要求

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

适用范围：The document specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, q...

实施日期：2003-01-01

EN 61190-1-2-2007

Attachment materials for electronic assembly ?Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

EN ISO 9455-3-1994

Soft Soldering Fluxes. Test Methods. Part 3:Determination of Acid Value,Potentiometric and Visual Titration Methods;(ISO 9455-3 :1992)

实施日期：1994-01-01

DIN EN 60068-2-54-2007

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006)

实施日期：2007-01-01

IEC 61190-1-3 AMD 1-2010

修改件1 电子组件用连接材料 第1-3部分:电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料用要求

AMENDMENT 1 Attachment materials for electronic assembly. Part 1-3:Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications

适用范围：This amendment has been prepared by IEC technical committee 91: Electronics assemblytechnology

实施日期：2010-06-01

ISO 9455-10-2012

软钎焊剂 试验方法 第10部分:助焊剂药效试验、焊接传授方法

Soft soldering fluxes -- Test methods -- Part 10: Flux efficacy test, solder spread method

发布日期：2012-09-01  实施日期：2012-09-01

BS EN ISO 9455-15-2000

软钎焊剂.试验方法.铜腐蚀试验

Flussmittel zum Weichloeten. Pruefverfahren. Kupferkorrosionspruefung Soft Soldering Fluxes-Test Methods-Part 15:Copper Corrosion Test Flux de brasage tendre. Methodes d'essai. Essai de corrosion de cu...

适用范围：This part of ISO 9455 specifies a qualitative method for determination of the corrosive properties of flux residues on a copper substrate, when subjected to controlled environmental conditions. The tes...

实施日期：2000-05-15

EN ISO 9455-6-1997

Soft Soldering Fluxes. Test Methods. Part 6:Determination and Detection of Halide (Excluding Fluoride) Content ISO 9455-6:1995

实施日期：1997-01-01

JIS Z3353-1999

低碳钢和高拉伸强度钢用电渣焊实心焊丝以及焊剂

Electroslag welding solid wires and fluxes for mild steel and high strength steel

适用范围：この規格は，軟鋼，引張強さ490N/mm<上2>級高張力網及び引張強さ590N/mm<上2>級高張力鋼のエレクトロスラグ溶検に使用するソりッドワイヤ(以下，ワイヤという。)，フラックス及び消耗ノズルについて規定する。

EN ISO 9455-9-1995

Soft Soldering Fluxes. Test Methods. Part 9:Determination of Ammonia Content (ISO 9455-9 :1993)

实施日期：1995-01-01

BS EN ISO 9455-9-1996

软钎焊剂.试验方法.第9部分:氨含量测定

Flussmittel zum Weichloeten. Pruefverfahren. Bestimmung des Ammoniumgehaltes Soft Soldering Fluxes-Test Methods Part 9:Determination of Ammonia Content Flux de brasage tendre. Méthodes d'essai. Dosage ...

适用范围：This part of ISO 9455 specifies a distillation method for the determination of the ammonia content of solid, paste or liquid fluxes. The method is applicable to fluxes of class 3.1.1 only, as defined i...

实施日期：1996-02-15

BS EN 2591-514-2002

电气和光学连接元件.试验方法.自带焊料和助熔剂的焊接点的可焊接性

Luft-und Raumfahrt. Elektrische und optische Verbindungselemente. Pruefverfahren. Loetbarkeit von Kontakten mit eingearbeitetem Loet-und Flussmittel Elements of electrical and optical connection Test m...

适用范围：This standard specifies a method of verifying solderability of contacts with self-contained solder and flux,which are not accessible to a solder iron.

实施日期：2002-07-09

DIN EN 29455-11-1994

软焊剂试验方法.第11部分:焊剂残留量熔性测定

Soft soldering fluxes; test methods; part 11: solubility of flux residues (ISO 9455-11:1991); German version EN 29455-11:1993

NF A81-365-14-1993

Solft soldering fluxes. Test methods. Part 14 : assessment of tackiness of flux residues.

EN 1045-1997

Brazing. Fluxes for Brazing. Classification and Technical Delivery Conditions

实施日期：1997-06-01

DIN EN 2591-501-2003

航空和航天 光电连接件 试验方法 第501部分:软焊性

Aerospace series - Elements of electrical and optical connection; test methods - Part 501: Soft solderability

适用范围：The document specifies methods of verifying the solderability of electrical male and female contacts to be soldered in elements of connection and of contacts with self-contained solder and flux not acc...

BS EN 61189-5-2006

Test methods for electrical materials, interconnection structures and assemblies. Test methods for printed board assemblies

实施日期：2009-02-28

DIN EN 61189-5-2007

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006)

实施日期：2007-05-01