NF C93-760-1996

Base materials for printed circuits. Part 2 : specifications. Specification number 10 : epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test).

NF C93-759-1996

Base materials for printed circuits. Part 2 : specifications. Specification number 9 : epoxide cellulose paper core, epoxyde glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test).

DIN 50450-2-1991

半导体技术的材料检验.载气体和掺杂气体中杂质的测定.用原电池测定氮,氩,氖和氢中的氧杂质

Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of oxygen impurity in N<(Index)2>, Ar, He, Ne and H<(Index)2> by using a ...

适用范围：The standard should define the test method for determining the content of O<(Index)2> in the carrier and doping gases N<(Index)2>, Ar, He, Ne and H<(Index)2>.#,,#

DIN 50450-4-1993

半导体技术的材料试验

Testing of materials for semiconductor technology; determination of impurities in carrier gases and dopant gases; determination of C<(Index)1>-C<(Index)3>-hydrocarbons in nitrogen by gas-chromatography...

适用范围：This document specifies a method for the determination of the volume part of C<(Index)1>-C<(Index)3>-hydrocarbons in nitrogen in the range between 0,2 and 10 ?l.#,,#

DIN 50456-3-1999

半导体技术用材料的试验.电子元件用模塑件的性能测定方法.第3部分:阳离子受主杂质

Testing of materials for semiconductor technology - Method for the characterisation of moulding compounds for electronic components - Part 3: Determination of cationic impurities

适用范围：The document defines a method for the determination of Na, K and CA in moulding compounds for electronic components by analysis of an aqueous extract of the epoxy resin moulding compound by means of th...

DIN 50450-1-1987

半导体工艺检验和材料;载气体和渗气体中杂质测定;用五氧化二磷测氢中等杂质

Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of water impurity in hydrogen, oxygen, nitrogen, argon and helium by usin...

适用范围：The standard determines a test method for the determination of water impurity in carrier gases and doping gases (H<(Index)>2, O<(Index)2>, N<(Index)2>, Ar, He) used in the semi conductor technology.

IEC 60987-2007

核电厂 对安全重要的测试设备和控制 以计算机为基础的系统用硬件设计要求

Nuclear power plants - Instrumentation and control important to safety - Hardware design requirements for computer-based systems

适用范围：Is applicable to computer-system hardware for systems of Class 1 and 2 (as defined by IEC 61513) in nuclear power plants. This new edition reflects recent developments in computer system hardware desig...

发布日期：2007-08-27  实施日期：2007-08-27

NF C93-749-1996

Base materials for printed circuits. Part 2 : specifications. Specification number 1 : phenolic cellulose paper copper-clad laminated sheet, high electrical quality.

DIN 50453-1-1990

半导体技术用材料的检验;腐蚀剂腐蚀率的测定;单晶硅,重量法

Testing of materials for semiconductor technology; determination of etch rates of etching mixtures; silicium monocrystals; gravimetric method

DIN 50452-1-1995

半导体材料的检验.液体中粒子的分析方法.第1部分:显微镜测定粒子

Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 1: Microscopic determination of particles

适用范围：This method cover the determination of the concentration of particulate matter contamination from liquids isolated on a membrane filter by microscopic counting. The scope is limited to sizing particles...

NF C93-756-1996

Base materials for printed circuits. Part 2 : specifications. Specification no 6 : phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test).

JIS C0806-1-1999

自动安装用元件的包装－第1部分:轴向导线端子零件在连续带上的带式包装

Packaging of components for automatic handling -- Part 1: Tape packaging of components with axial leads on continuous tapes

适用范围：この規格は，電子機器用アキシャルリード線端子部品のテープによるペッもソグージングについて適用する。通常，部品のリード線端子をテープで固定する。この規格は，自動実装，リード線端子の加工，挿入などの操作を行う装置を用いるテーピングの要求事項について規定する。また，上記の目的のため.部品のテーピング...

DIN 50450-9-2003

半导体工艺材料的检验 载运气体和混合气体中杂质的测定 第9部分:气体分光光度法测定气态氯化氢中的氧、氮、一氧化碳、氢和C1-C3氯化氢

Testing of materials for semiconductor technology; Determination of impurities in carrier gases and dopant gases - Part 9: Determination of oxygen, nitrogen, carbonmonxide, carbondioxide, hydrogen and ...

NF C93-764-1996

Base materials for printed circuits. Part 2 : specifications. Specification number 14 : phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality.

DIN 50453-2-1990

半导体工艺材料的检验.蚀刻混合剂浸蚀率的测定.第2部分:二氧化硅涂层.光学法

Testing of materials for semiconductor technology; determination of etch rates of etching mixtures; silicium-dioxid coating; optical method

适用范围：The standard defines the test method for the determination of etch rates of etch mixtures on siliciumdioxid coatings.

DIN 50451-5-2010

Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 5: Guideline for the selection of materials and testing of their suitability for apparatus for sampling and sample preparation for the determination of trace elements in the range of micrograms per kilogram and nanograms per kilogram

实施日期：2010-03-01

NF C93-766-1994

Base materials for printed circuits. Part 2 : specifications. Specification number 16 : polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).

BS IEC 62671-2013

核电厂 对安全具有重要影响的测试设备和控制 有限功能的工业数字设备的选择和使用

Nuclear power plants. Instrumentation and control important to safety. Selection and use of industrial digital devices of limited functionality

发布日期：2013-03-31  实施日期：2013-03-31

NF C93-752/A1-2001

Base materials for printed circuits - Part 2 : specification - Specification n o 2 : phenolic cellulose paper copper-clad laminated sheet, economic quality.

NF C93-754-1996

Base materials for printed circuits. Part 2 : specifications. Specification no 4 : epoxide woven glass fabric copper-clad laminated sheet, general purpose grade.