NF C93-764-1996

Base materials for printed circuits. Part 2 : specifications. Specification number 14 : phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality.

NF C93-754-1996

Base materials for printed circuits. Part 2 : specifications. Specification no 4 : epoxide woven glass fabric copper-clad laminated sheet, general purpose grade.

DIN 50453-2-1990

半导体工艺材料的检验.蚀刻混合剂浸蚀率的测定.第2部分:二氧化硅涂层.光学法

Testing of materials for semiconductor technology; determination of etch rates of etching mixtures; silicium-dioxid coating; optical method

适用范围：The standard defines the test method for the determination of etch rates of etch mixtures on siliciumdioxid coatings.

DIN 50450-1-1987

半导体工艺检验和材料;载气体和渗气体中杂质测定;用五氧化二磷测氢中等杂质

Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of water impurity in hydrogen, oxygen, nitrogen, argon and helium by usin...

适用范围：The standard determines a test method for the determination of water impurity in carrier gases and doping gases (H<(Index)>2, O<(Index)2>, N<(Index)2>, Ar, He) used in the semi conductor technology.

DIN 50451-5-2010

Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 5: Guideline for the selection of materials and testing of their suitability for apparatus for sampling and sample preparation for the determination of trace elements in the range of micrograms per kilogram and nanograms per kilogram

实施日期：2010-03-01

NF C93-757-1996

Base materials for printed circuits. Part 2 : specifications. Specification no 7 : phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test).

NF C93-761-1996

Base materials for printed circuits. Part 2 : specifications. Specification no 11 : thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards.

DIN 50451-2-2003

半导体工艺的材料检验 液体中痕量元素的测定 第2部分:用等离子激励发射光谱测定氢氟酸中的钙(Ca)、钴(Co)、铬(Cr)、铜(Cu)、铁(Fe)、镍(Ni)和锌(Zn)

Testing of materials for semiconductor technology; determination of traces of elements in liquids; Part 2: Calcium(Ca), cobalt(Co), chromium(Cr), copper(Cu), iron(Fe), nickel(Ni) and zinc(Zn) in hydrof...

适用范围：The document specifies a method for testing hydrofluoric acid for the metal traces of cobalt (Co), chromium (Cr), copper (Cu), iron (Fe), and nickel (Ni) relevant to semiconductor technology. Emission ...

DIN 50453-1-1990

半导体技术用材料的检验;腐蚀剂腐蚀率的测定;单晶硅,重量法

Testing of materials for semiconductor technology; determination of etch rates of etching mixtures; silicium monocrystals; gravimetric method

DIN 50450-2-1991

半导体技术的材料检验.载气体和掺杂气体中杂质的测定.用原电池测定氮,氩,氖和氢中的氧杂质

Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of oxygen impurity in N<(Index)2>, Ar, He, Ne and H<(Index)2> by using a ...

适用范围：The standard should define the test method for determining the content of O<(Index)2> in the carrier and doping gases N<(Index)2>, Ar, He, Ne and H<(Index)2>.#,,#

DIN 50450-9-2003

半导体工艺材料的检验 载运气体和混合气体中杂质的测定 第9部分:气体分光光度法测定气态氯化氢中的氧、氮、一氧化碳、氢和C1-C3氯化氢

Testing of materials for semiconductor technology; Determination of impurities in carrier gases and dopant gases - Part 9: Determination of oxygen, nitrogen, carbonmonxide, carbondioxide, hydrogen and ...

DIN 50450-3-1991

半导体工艺材料的检验.载运气体和混合气体中杂质的测定.第3部分:用火焰电离检验测器测定氢(下标2)、氧(下标2)、氮(下标2)、氩、氦中的甲烷杂质

Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of methane impurity in H<(Index)2>, O<(Index)2>, N<(Index)2>, Ar and He b...

DIN 50451-1-2003

半导体工艺的材料检验 液体中痕量元素的测定 第1部分:用AAS法测定硝酸中的银、金、钙、铜、铁、钾和钠

Testing of materials for semiconductor technology; determination of traces of elements in liquids; Part 1: Silver(Ag), gold(Au), calcium(Ca), copper(Cu), iron(Fe), potassium(K) and soldium(Na) in nitri...

适用范围：The document specifies a method for testing nitric acid for the relevant metal traces of silver, gold, copper, iron, potassium and sodium in trace quantities, for which the method of atomic absorption ...

DIN EN 60987-2010

核电厂 对安全重要的测试设备和控制 以计算机为基础的系统用硬件设计要求

Nuclear power plants - Instrumentation and control important to safety - Hardware design requirements for computer-based systems

适用范围：This standard covers digital systems hardware for Class 1 and Class 2 systems as derived from the safety categories of the realized functions according to DIN IEC 61513 (VDE 0491-2). This also includes...

实施日期：2010-03-01

ASTM E1438-2006

使用SIMS测量溅射深压型中界面宽度的指南

Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS

适用范围：<p id="s00014">Although it would be desirable to measure the extent of profile distortion in any unknown sample by using a standard sample and this guide, measurements of interface width (profile disto...

实施日期：2006-11-01

DIN 50456-3-1999

半导体技术用材料的试验.电子元件用模塑件的性能测定方法.第3部分:阳离子受主杂质

Testing of materials for semiconductor technology - Method for the characterisation of moulding compounds for electronic components - Part 3: Determination of cationic impurities

适用范围：The document defines a method for the determination of Na, K and CA in moulding compounds for electronic components by analysis of an aqueous extract of the epoxy resin moulding compound by means of th...

NF C93-754/A1-2000

Base materials for printed circuits. Part 2 : specifications. Specification no 4 : epoxide woven glass fabric copper-clad laminated sheet, general purpose grade.

JIS C0806-1-1999

自动安装用元件的包装－第1部分:轴向导线端子零件在连续带上的带式包装

Packaging of components for automatic handling -- Part 1: Tape packaging of components with axial leads on continuous tapes

适用范围：この規格は，電子機器用アキシャルリード線端子部品のテープによるペッもソグージングについて適用する。通常，部品のリード線端子をテープで固定する。この規格は，自動実装，リード線端子の加工，挿入などの操作を行う装置を用いるテーピングの要求事項について規定する。また，上記の目的のため.部品のテーピング...

DIN 50452-3-1995

半导体技术用材料的检验.液体中粒子分析的检验方法.第3部分:光学粒子计数器的校准

Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 3: Calibration of optical particle counters

适用范围：The document describes methods for the determination of measuring deviations of particle sizes, particle concentrations and the resolving capacity of optical particle counters based upon measuring of t...