DIN EN 61967-6-2008

集成电路 150kHz-1GHz电磁辐射的测量 第6部分:传导辐射的测量 磁探针法

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

实施日期：2008-10-01

BS EN 61249-7-1-1996

互连接装置用材料.第7部分:芯约束用材料分规范.第1节:铜/殷钢/铜

Materialien fuer Verbindungsstrukturen. Rahmenspezifikation fuer Materialien mit verzugsfreiem Kern. Kupfer/Invar/Kupfer Materials for Interconnection Structures Part 7:Sectional Specification Set for ...

实施日期：1996-01-01

BS ISO 17331-2004+A1-2010

Surface chemical analysis. Chemical methods for the collection of elements from the surface of silicon-wafer working reference materials and their determination by total-reflection X-ray fluorescence (TXRF) spectroscopy

实施日期：2005-03-31

JIS C6522-1996

多层印制电路板用聚酯胶片－玻璃布基环氧树脂

Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth

BS EN 60664-3-2003+A1-2010

Insulation coordination for equipment within low-voltage systems. Use of coating, potting or moulding for protection against pollution

实施日期：2003-06-09

IEC 61249-4-5-2005

印制板和其他互连结构用材料 第4-5部分:非包层预浸渍材料的分规范集 阻燃型改性或未改性的聚酰亚胺编织的E玻璃预浸渍材料

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of def...

发布日期：2005-09-05  实施日期：2005-09-05

IEC 61076-4-103-1999

直流和低频模拟及数字式高速数据处理设备用连接器 第4-103部分:有质量评定的印制板连接器 带屏蔽及基本网格为2.5mm的两件式连接器的详细规范

Connectors for use in d.c. low-frequency analogue and digital high speed data applications - Part 4-103: Printed board connectors with assessed quality - Detail specification for two-part connectors wi...

发布日期：1999-02-26  实施日期：1999-02-26

IEC 61249-2-39-2012

印制板和其它互连结构用材料 第2-39部分:包层和非包层增强基材 铜包钢无铅装配用规定了燃烧性的高性能环氧和非卤环氧化物编织E玻璃层压板(垂直燃烧法)

Materials for printed boards and other interconnecting structures. Part 2-39:Reinforced base materials clad and unclad. High performance epoxide and non-epoxide,woven E-glass laminate sheets of defined...

实施日期：2012-11-29

BS CECC 75101-1984

Harmonisiertes Guetebestaetigungssystem fuer Bauelemente der Elektronik. Beispiel einer Bauartspezifikation/Vordruck fuer Bauartspezifikation. Indirekte Steckverbindungen fuer gedruckte Schaltungen Two-Part and Edge Socket Connectors for Printed Board Application:Example Detail Specification/ Blank Detail Specification Système harmonise d'assurance de la qualite des composants electroniques. Example de specification particulière/specification particulière cadre. Connecteurs en deux parties et le

实施日期：1984-01-01

BS EN 160101-1998

电子元器件质量评定协调系统.空白详细规范:经质量评定的装有电子模块的印制电路板.合格认证

Vordruck fuer Bauartspezifikation:Leiterplatten,die mit Moduleinheiten der Elektronik bestueckt sind,mit bewerteter Qualitaet Befaehigungsanerkennung Harmonized System of Quality Assessment for Electro...

实施日期：1998-12-15

GB/T 15157.12-2011

频率低于3MHz的印制板连接器 第12部分：集成电路插座的尺寸、一般要求和试验方法详细规范

Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated...

发布日期：2011-12-30  实施日期：2012-07-01

NF C93-441-2-1-2002

Modular order for the development of mechanical structures for electronic equipment practices - Part 2 : sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Secion 1 : detail specification - Dimensions for cabi

IEC 61076-4-102-1997

有质量评定的直流和低频模拟及数字式高速数据处理设备用连接器 第4部分:印制板连接器 第102节:符合IEC 60917的公制网格,有预定中心、编码及预插合特性,多用途插件用两件式单极连接器的详细规范

Connectors with Assessed Quality for Use in d.c.,Low-Frequency Analogue and in Digital High Speed Data Applications. Part 4:Printed Board Connectors. Section 102:Detail Specification for Two-Part Singl...

实施日期：1997-04-01

IEC 62137-1-5-2009

表面安装技术 表面安装焊缝的环境和耐久性试验方法 第1-5部分:机械剪切疲劳试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

发布日期：2009-02-11  实施日期：2009-02-11

BS 123000-2001

质量评估体系 通用规范 印刷板

System of Quality Assessment-Generic Specification-Printed Boards

实施日期：2001-12-17

BS EN 160100-1998

电子元器件质量评定协调体系.分规范:经过质量评定的印制板组件制造厂的能力鉴定

Rahmenspezifikation:Befaehigungsanerkennung fuer Hersteller von bestueckten Leiterplatten mit bewerteter Qualitaet Harmonized System of Quality Assessment for Electronic Components Sectional Specificat...

实施日期：1998-02-15

BS EN 60950-1-2006+A1-2010

Information technology equipment. Safety. General requirements

实施日期：2006-05-31

DIN EN 123500-800-1992

详细规范.印制线路板

Capability detail specification: flexible printed boards with through connections; german version EN 123500-800:1992

DIN 41617-2-1989

印制电路用插接件,（双列、圆销） 参数,要求 检验

Two-part connectors for printed boards, grid 2,5 mm; gauges, ratings, requirements, tests

BS EN 61188-1-2-1998

印制板和组件.设计和使用.常规要求.控制阻抗

Leiterplatten und Flachbaugruppen Konstruktion und Anwendung. Allgemeine Anforderungen Definierte Impedanz Printed Boards and Printed Board Assemblies-Design and Use-Part 1-2:Generic Requirements-Contr...

实施日期：1998-12-15