IEC 61191-1-2013

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

发布日期：2013-05-21  实施日期：2013-05-21

BS EN 61249-5-1-1996

连接结构用材料.第5部分:带和不带涂层的导电箔和薄膜的分规范.第1节:铜箔(用于生产铜涂覆基材)

Materialien fuer Verbindungsstrukturen. Rahmenspezifikation fuer leitfaehige Folien mit und ohne Beschichtungen. Kupfer-Foilen (zur Herstellung von kupferkaschierten Basismaterialien Materials for Inte...

实施日期：1996-01-01

BS EN 62137-1-4-2009

Oberfl?chenmontage-Technik. Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberfl?chen-L?tverbindungen. Zyklische Biegeprüfung Surface mounting technology-Environmental and endurance test methods for surface mount solder joint-Part 1-4:Cyclic bending test Technologie de montage en surface. Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface. Essai de flexion cyclique

实施日期：2009-03-31

IEC 61988-2-5-2012

等离子体显示板 第2-5部分:测量方法 噪音

Plasma display panels - Part 2-5: Measuring methods - Acoustic noise

发布日期：2012-05-15  实施日期：2012-05-15

IEC 61188-1-1-1997

印制电路板和印制电路板组件 设计和使用 第1-1部分:一般要求 电子组件的平整度情况

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

发布日期：1997-08-26  实施日期：1997-08-26

NF C93-025-2012

无焊连接件.第5部分:压入式连接件.一般要求、试验方法和操作规程指南

Solderless connections - Part 5 : press-in connections - General requirements, test methods and practical guidance.

QJ 2151-1991

印制电路板碱性蚀刻技术要求及操作规程

发布日期：1991-02-05  实施日期：1991-12-05

NF C20-745-1993

环境试验.第2部分:试验.试验XA和导则:在清洗剂中浸渍

Environmental testing. Part 2 : tests. Test Xa and guidance : immersion in cleaning solvents.

DIN EN 60297-3-102-2005

482.6ｍｍ(19英寸)系列机械结构件 第3-102部分:插入拔出手柄

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482, 6 mm (19 in) series - Part 3-102: Injector/extractor handle (IEC 60297-3-102:2004)

实施日期：2005-06-01

DIN EN 60950-1-2011

Information technology equipment. Safety. Part 1:General requirements (IEC 60950-1:2005,modified + Cor. :2006 + A1:2009,modified); German version EN 60950-1:2006 + A11:2009 + A1:2010

EN 60917-2-2-1996

Modular Order for the Development of Mechanical Structures for Electronic Equipment Practices Part 2: Sectional Specification - Interface Co-Ordination Dimensions for the 25 mm Equipment Practice Section 2: Detail Specification - Dimensions for Subracks, Chassis, Backplanes, Front Panels and Plug-In Units IEC 917-2-2: 1994

EN 14612-2003

Space product assurance Verification and approval of automatic machine wave soldering

实施日期：2003-08-01

IEC 61249-2-35-2008

印制板和其他互连结构用材料 第2-35部分:包层和非包层增强基材 无铅装配用阻燃型铜包改性环氧化物编织的E玻璃层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (verti...

发布日期：2008-11-27  实施日期：2008-11-27

EN 61188-5-1-2002

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements IEC 61188-5-1: 2002

EN 62326-4-1997

Printed Boards; Part 4: Rigid Multilayer Printed Boards with Interlayer Connections Sectional Specifications IEC 2326-4:1996

EN 61086-3-1-2004

Coatings for loaded printed wire boards (conformal coatings) Part 3-1: Specifications for individual materials - Coatings for general purpose (Class 1), high reliability (Class 2) and aerospace (Class 3) (IEC 61086-3-1:2004)

DIN EN 61249-3-3-1999

印制板和其它互连结构用材料.第3-3部分:包层和未包层非增强基材(用于挠性印制板)的分规范集.粘性涂覆挠性聚酯薄膜

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesi...

实施日期：1999-11-01

GB/T 20633.1-2006

承载印制电路板用涂料（敷形涂料）第1部分：定义、分类和一般要求

Coatings for loaded printed wire boards(conformal coating）- Part 1: Definitions,classification and general requirements

发布日期：2006-11-09  实施日期：2007-04-01

IEC 62496-2-1-2011

光学电路板 第2-1部分:测量 光学衰减与隔离

Optical circuit boards - Part 2-1: Measurements - Optical attenuation and isolation

发布日期：2011-07-28  实施日期：2011-07-28

GB/T 4677.12-1988

印制板互连电阻测试方法

Test method of interconnection resistance for printed boards