EN 60603-10-1998

Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 10: Two-Part Connectors for Printed Boards for Basic Grid of 2,54 mm (0,1 in), Inverted Type IEC 60603-10:1991

BS EN 61967-1-2002

集成电路 150 kHz～1 GHz电磁辐射的测量 第1部分:一般条件和定义 IEC 61967-1:2002

Integrierte Schaltungen-Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz. Allgemeine Bedingungen und Definitionen Integrated Circuits-Measurement of Electromagnetic...

实施日期：2002-07-02

EN 61192-4-2003

Workmanship requirements for soldered electronic assemblies Part 4: Terminal assemblies IEC 61192-4:2002

IEC 61193-1-2001

质量评定体系 第1部分:印刷板组件缺陷的记录和分析

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

发布日期：2001-12-19  实施日期：2001-12-19

IEC/PAS 62326-20-2011

印制电路板 第20部分:高亮度发光二极管用电子线路板

Printed boards. Part 20:Electronic circuit board for high-brightness LEDs

发布日期：2011-01-26  实施日期：2011-01-26

IEC 61192-5-2007

焊接电子组件的工艺要求 第5部分:焊接电子组件的再加工、改进和检修

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

发布日期：2007-05-23  实施日期：2007-05-23

NF C93-347-2005

Magnetic oxide EP-cores and associated parts for use in inductors and transformers - Dimensions.

NF C93-420-1984

电子元件 连接元件 ＨＥ１２型节距为２·５４毫米的印制电路用插入式多触点接头 一般规定

Electronic components. Connecting devices. Multicontact board mounted connectors for pb with 2,54 mm spacing. Type he 12.

实施日期：1984-10-01

BS EN 60097-1993

印制电路的网格系统规范

Rastersysteme fuer gedruckte schaltungen Grid Systems for Printed Circuits (IEC 97:1991) (S) Systèmes de grille pour circuits imprimes

实施日期：1993-01-01

DIN EN 14612-2004

Space product assurance - Verification and approval of automatic machine wave soldering

实施日期：2004-05-01

EN 60297-3-101-2004

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 3-101: Subracks and associated plug-in units IEC 60297-3-101:2004; Supersedes HD 493.3 S2:1993, EN 60297-4:1995 + A1:1999, EN 60297-5-100:2001, EN 60297-5-102:2001, EN 60297-5-103:2001& EN 60297-5-107:2001

NF C93-406-4-111-2004

Connectors for electronic equipment - Part 4-111 : printed board connectors with assessed quality - Detail specification for two-part power connector modules, for printed boards and backplanes having early mating features, and having a basic grid of 2,5

BS EN 61188-5-4-2007

Leiterplatten und Flachbaugruppen. Konstruktion und Anwendung. Betrachtungen zur Montage (Anschlussfl?che/Verbindung). Bauelemente mit J-f?rmigen Anschlüssen auf zwei Seiten Printed boards and printed board assemblies. Design and use. Part 5-4:Attachment (land/joint) considerations. Components with J leads on two sides Cartes imprimées et cartes imprimées équipées. Conception et utilisation. Considérations sur les liaisons pistes-soudures. Composants. sorties en J sur deux c?tes

实施日期：2007-12-31

EN 61076-4-110-2002

Connectors for Electronic Equipment - Part 4-110: Printed Board Connectors with Assessed Quality - Detail Specification for Latched Cable Connector System Having a Basic Grid of 2,0 mm Including Full Shielding and Latching Function IEC 61076-4-110:2001

BS DD IEC/PAS 62326-14-2010

Printed boards Part 14:Device embedded substrate. Terminology / reliability / design guide

实施日期：2010-11-30

BS CECC 123400-003-1994

Harmonized System of Quality Assessment for Electronic Components:Capability Detail Specification:Flexible Printed Boards Without Through-Connections (Read in Conjunction with BS EN 123400) (T)

实施日期：1994-01-01

BS EN 61988-2-3-2009

Plasma display panels. Measuring methods. Image quality. Defects and degradation

实施日期：2010-01-31

BS EN 61191-3-1999

印刷电路板组件.分规范.通孔安装焊接组件的要求

Elektronikaufbauten auf Leiterplatten. Rahmenspezifikation Anforderungen an geloetete Baugruppen in Durchsteckmontage Printed Board Assemblies-Part 3:Sectional Specification-Requirements for Through-Ho...

实施日期：1999-01-15

BS EN 61249-2-12-1999

互联结构材料.包被和非包被的加强基质材料的分规范.阻燃环氧衍生物叠层板材.铜包被

Materialien fuer Leiterplatten und andere Verbindungsstrukturen. Rahmenspezifikation fuer verstaerkte,kaschierte und unkaschierte Basismaterialien Aramidwirrfaser-verstaerktes Epoxidharz-Laminat mit de...

实施日期：1999-06-15

BS EN 61249-2-5-2003

Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning

实施日期：2004-02-19