Environmental testing. Part 3-12:Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profil
实施日期：2007-03-01
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering h...
适用范围：IEC 60749-20-1:2009 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. The purpose of this document is to provide SMD manu...
发布日期：2009-04-07 实施日期：2009-04-07
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010); German version EN 61760-3:2010
实施日期：2010-12-01
Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
适用范围：IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in t...
发布日期：2010-03-16 实施日期：2010-03-16
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