EN 123300-1992

Sectional Specification: Multilayer Printed Boards Incorporates Amendment A1: 1995

NF C93-759-1996

Base materials for printed circuits. Part 2 : specifications. Specification number 9 : epoxide cellulose paper core, epoxyde glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test).

BS EN 61249-4-16-2009

Materialien für Leiterplatten und andere Verbindungsstrukturen. Rahmenspezifikationen für unkaschierte Prepreg-Materialien (zur Herstellung von Mehrlagenleiterplatten). Mit E-Glasgewebe verst?rkte Prepregs auf der Basis von multifunktionalem halogenfreiem Epoxidharz mit definierter Brennbarkeit (Brennprüfung mit vertikaler Prüflingslage) für bleifreie Bestückungstechnik Materials for printed boards and other interconnecting structures. Part 4-16:Sectional specification set for prepreg materials,

实施日期：2009-10-31

NF C93-767-1994

Base materials for printed circuits. Part 2 : specifications. Specification number 17 : thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board.

EN 61249-4-1-2008

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

IEC 61249-4-16-2009

印制板和其他互连结构用材料 第4-16部分:非包层预浸渍材料的分规范集（用于多层板制造） 无铅组件用阻燃型多功能非卤化环氧化物编织的E玻璃预浸渍材料(垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Part 4-16:Sectional specification set for prepreg materials,unclad (for the manufacture of multilayer boards). Multifunctional non-hal...

发布日期：2009-05-26  实施日期：2009-05-26

NF C93-780-4-12-2006

Materials for printed boards and other interconnecting structures - Part 4-12 : sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability.

DIN EN 62317-9-2008

Ferrite cores - Dimensions - Part 9: Planar cores

实施日期：2008-01-01

NF C93-708-1998

Printed boards. Part 4 : rigid multilayer printed boards with interlayer connections. Sectional specification.

IEC 61249-4-1-2008

印制板和其他互连结构用材料 第4-1部分:非包层预浸渍材料的分规范集（用于多层板制造） 阻燃型环氧化物编织的E玻璃预浸渍材料

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glas...

适用范围：IEC 61249-4-1:2008 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-7 when manufacturing multilaye...

发布日期：2008-01-30  实施日期：2008-01-30

DIN EN 123300-1992

分规范.多层印制电路板

Sectional specification: multilayer printed boards; german version EN 123300:1992

适用范围：This sectional specification is applicable to multilayer printed boards.

DIN EN 62326-4-1-1997

印制线路板.第4部分:带内层连接的刚性多层印制线路板.分规范.第1节:容量详细规范.性能级A,B和C

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections; sectional specification; section 1: Capability detail specification; performance levels A, B and C (IEC 62326-4-1:1...

UL 796F-2010

柔性材料互连结构

UL Standard for Safety Flexible Materials Interconnect Constructions Second Edition

发布日期：2010-10-25  实施日期：2010-10-25

NF C93-752-1996

Base materials for printed circuits. Part 2 : specifications. Specification number 2 : phenolic cellulose paper copper-clad laminated sheet, economic quality.

EN 62326-4-1-1997

Printed Boards; Part 4: Rigid Multilayer Printed Boards with Interlayer Connections Sectional Specification; Section 1: Capability Detail Specification Performance Levels A, B and C IEC 2326-4-1:1996

QJ 3113-1999

多层印制电路板用粘结片复验规则和方法

实施日期：1999-11-30

EN 62326-4-1997

Printed Boards; Part 4: Rigid Multilayer Printed Boards with Interlayer Connections Sectional Specifications IEC 2326-4:1996

NF C93-749-1996

Base materials for printed circuits. Part 2 : specifications. Specification number 1 : phenolic cellulose paper copper-clad laminated sheet, high electrical quality.

BS EN 62317-9-2006

Ferritkerne. Masse. Planarkerne Ferrite cores. Dimensions. Part 9:Planar cores Noyaux ferrites. Dimensions. Noyaux planaires AMD 17096:May 31,2007

实施日期：2006-10-31

DIN EN 61249-4-1-2008

印制板和其他互连结构用材料 第4-1部分:非包层预浸渍材料的分规范集（用于多层板制造） 阻燃型环氧化物编织的E玻璃预浸渍材料

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glas...

实施日期：2008-10-01