BS EN 60384-22-2012

Fixed capacitors for use in electronic equipment. Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric,Class 2

发布日期：2012-04-30 

IEC 62137-1-5-2009

表面安装技术 表面安装焊缝的环境和耐久性试验方法 第1-5部分:机械剪切疲劳试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

发布日期：2009-02-11  实施日期：2009-02-11

DIN EN 60191-6-19-2010

半导体器件的机械标准化 第6-19部分:高温时封装热变形的测量方法和最大允许热变形

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German ver...

实施日期：2010-10-01

DIN EN 29367-1-1994

在RO-RO海运船上车辆的捆绑及固定装置.一般要求.第1部分:商用车辆及车辆组合,半拖车除外

Lashing and securing arrangements on road vehicles for sea transportation on Ro/Ro ships - General requirements - Part 1: Commercial vehicles and combinations of vehicles, semi-trailers excluded (ISO 9...

NF C20-700-2-69-2013

Environmental testing - Part 2-69 : tests - Test Te : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

NF C96-022-20-2010

Semiconductor devices - Mechanical and climatic test methods - Part 20 : resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat.

IEC 60191-6-20-2010

半导体器件的机械标准化 第6-20部分:表面安装半导体器件封装外形图绘制的一般规则 小型J形引线封装(SOJ)的封装尺寸测量方法

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package d...

发布日期：2010-08-30  实施日期：2010-08-30

IEC 60286-3-2013

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

发布日期：2013-05-17  实施日期：2013-05-17

NF C93-351-1-2013

High frequency inductive components - Part 1 : fixed surface mount inductors for use in electronic and telecommunication equipment.

EN 61188-5-4-2007

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

IEC 60191-6-19-2010

半导体器件的机械标准化 第6-19部分;高温时封装热变形的测量方法和最大允许热变形

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

发布日期：2010-02-25  实施日期：2010-02-25

IEC 61191-1-2013

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

发布日期：2013-05-21  实施日期：2013-05-21

BS EN 62137-1-4-2009

Oberfl?chenmontage-Technik. Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberfl?chen-L?tverbindungen. Zyklische Biegeprüfung Surface mounting technology-Environmental and endurance test methods for surface mount solder joint-Part 1-4:Cyclic bending test Technologie de montage en surface. Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface. Essai de flexion cyclique

实施日期：2009-03-31

IEC 61300-2-51-2007

纤维光学互连器件和无源器件 基本试验和测量程序 第2-51部分:试验 带外加拉伸载荷的传输用纤维光学连接器试验 单模和多模

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-51: Tests - Fibre optic connector test for transmission with applied tensile load - Singlemod...

发布日期：2007-06-05  实施日期：2007-06-05

BS EN 60191-6-18-2010

Mechanische Normung von Halbleiterbauelementen. Allgemeine Regeln für die Erstellung von Geh?usezeichnungen von SMD-Halbleitergeh?usen. Konstruktionsleitfaden für Ball-Grid-Array (BGA) Mechanical standardization of semiconductor devices Part 6-18:General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA) Normalisation mécanique des dispositifs. semiconducteurs. Règles générales pour la préparation des dessins d'e

实施日期：2010-04-30

DIN EN 140401-803-2013

Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2; German version EN 140401-803:2007 + A1:2010 + A2:2013

发布日期：2013-12-01  实施日期：2013-12-01

EN 61760-3-2010

Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering

BS EN 62137-1-1-2007

Oberfl?chenmontage-Technik. Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberfl?chen-L?tverbindungen. Zugfestigkeitsprüfung Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Part 1-1:Pull strength test Technique du montage en surface. Méthodes d'essai d'environnement et d'endurance des joints de soudure pour montage en surface. Essai de force d'arrachement

实施日期：2007-10-31

BS EN 61188-5-4-2007

Leiterplatten und Flachbaugruppen. Konstruktion und Anwendung. Betrachtungen zur Montage (Anschlussfl?che/Verbindung). Bauelemente mit J-f?rmigen Anschlüssen auf zwei Seiten Printed boards and printed board assemblies. Design and use. Part 5-4:Attachment (land/joint) considerations. Components with J leads on two sides Cartes imprimées et cartes imprimées équipées. Conception et utilisation. Considérations sur les liaisons pistes-soudures. Composants. sorties en J sur deux c?tes

实施日期：2007-12-31

DIN EN 62137-1-2-2008

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

实施日期：2008-02-01