Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defin...
实施日期:2004-06-01
Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammabi...
发布日期:2013-04-30 实施日期:2013-04-30
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad; Modified brominated epoxide woven fiberglass reinforced laminated sheets of de...
实施日期:2004-01-01
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burni...
实施日期:2009-07-01
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
发布日期:1996-06-18 实施日期:1996-06-18
Materials for printed boards and other interconnecting structures. Part 2-32:Reinforced base materials,clad and unclad. Halogenated modified or unmodified resin system,woven E-glass laminate sheets of ...
发布日期:2009-02-11 实施日期:2009-02-11
Materials for printed boards and other interconnecting structures. Part 2-27:Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate ...
实施日期:2012-11-29
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of def...
发布日期:2003-02-27 实施日期:2003-02-27
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