Materials for printed boards and other interconnecting structures. Part 2-31:Reinforced base materials,clad and unclad. Halogenated modified or unmodified resin system,woven E-glass laminate sheets of ...
发布日期:2009-02-11 实施日期:2009-02-11
Materials for printed boards and other interconnecting structures. Part 2-5:Reinforced base materials,clad and unclad Brominated epoxied cellulose paper reinforced core / woven E-glass reinforced surfa...
实施日期:2003-11-01
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non- halogenated epoxide non-woven/woven E-glass reinforced laminated sheets...
实施日期:2005-08-01
Insulating materials - Industrial rigid laminated sheets based on thermosetting resins for electrical purposes - Part 1: Definitions, designations and general requirements
实施日期:2004-12-01
Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined ...
发布日期:2003-11-12 实施日期:2003-11-12
Materials for printed boards and other interconnecting structures Part 2-10:Reinforced base materials clad and unclad Cyanate ester,brominated epoxide,modified or unmodified,woven E-glass reinforce...
实施日期:2003-02-01
Insulating materials - Industrial rigid laminated sheets based on thermosetting resins for electrical purposes - Part 3-3: Specifications for individual materials - Requirements for rigid laminated she...
发布日期:2003-11-14 实施日期:2003-11-14
Materials for printed boards and other interconnecting structures. Part 2-37:Reinforced base materials,clad and unclad. Modified nonhalogenated epoxide woven E-glass laminate sheets of defined flammabi...
发布日期:2008-11-27 实施日期:2008-11-27
Materials for printed boards and other interconnecting structures. Part 4-14:Sectional specification set for prepreg materials,unclad (for the manufacture of multilayer boards). Epoxide woven E-glass p...
发布日期:2009-05-26 实施日期:2009-05-01
Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of ...
发布日期:2013-04-30 实施日期:2013-04-30
High-pressure decorative laminates (HPL). Sheets based on thermosetting resins (Usually called Laminates). Part 1:Introduction and general information
实施日期:2005-01-01
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined fla...
实施日期:2009-07-01
Insulating materials. Industrial rigid laminated sheets based on thermosetting resins for electrical purposes. Part 3-7: Specifications for individual materials. Requirements for rigid laminated sheets...
实施日期:2010-05-01
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