Materials for printed boards and other interconnecting structures. Part 2-31:Reinforced base materials,clad and unclad. Halogenated modified or unmodified resin system,woven E-glass laminate sheets of ...
发布日期:2009-02-11 实施日期:2009-02-11
Materials for printed boards and other interconnecting structures Part 2-11:Reinforced base materials clad and unclad. polyimide,brominated epoxide,modified or unmodified,woven E-glass reinforced lam...
适用范围:Gives requirements for properties of polyimide, brominated epoxide modified or unmodified, woven E-glass laminated sheets, in thickness of 0,05 mm up to 3,2 mm, of defined flammability, copper-clad. Th...
实施日期:2003-11-01
High-pressure decorative laminates (HPL). Sheets based on thermosetting resins (Usually called Laminates). Part 1:Introduction and general information
实施日期:2005-01-01
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined...
发布日期:2013-09-01 实施日期:2013-09-01
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad; Modified brominated epoxide woven fiberglass reinforced laminated sheets of de...
适用范围:This standard gives requirements for properties of modified brominated epoxide woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,...
实施日期:2004-01-01
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinfor...
适用范围:This part of IEC 61249 gives requirements for properties of polyimide, brominated epoxide modified or unmodified, woven E-glass laminated sheets, in thickness of 0,05 mm up to 3,2 mm, of defined flamma...
实施日期:2004-06-01
Materials for printed boards and other interconnecting structures. Part 4-18:Sectional specification set for prepreg materials,unclad (for the manufacture of multilayer boards). High performance epoxid...
发布日期:2013-11-04 实施日期:2013-11-04
Insulating materials - Industrial rigid laminated sheets based on thermosetting resins for electrical purposes - Part 3-7: Specifications for individual materials - Requirements for rigid laminated she...
适用范围:Gives the requirements for industrial rigid laminated sheets for electrical purposes based on polyimide resins and different reinforcements. Applications and distinguishing properties are given. Materi...
发布日期:2003-11-14 实施日期:2003-11-14
Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of ...
发布日期:2013-04-30 实施日期:2013-04-30
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