AMENDMENT 1 Attachment materials for electronic assembly. Part 1-3:Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications
适用范围:This amendment has been prepared by IEC technical committee 91: Electronics assemblytechnology
实施日期:2010-06-01
Standard Test Method for Rapid Field Test for Trace Lead in Unleaded Gasoline (Colorimetric Method)
适用范围:<p>This test is used to determine trace quantities of lead in unleaded gasoline. Unwarranted amounts of lead may cause deposits in automotive pollution control equipment and poisoning of catalytic muf...
实施日期:2007-12-01
实施日期:2008-10-31
Materials for printed boards and other interconnecting structures. Part 2-39:Reinforced base materials clad and unclad. High performance epoxide and non-epoxide,woven E-glass laminate sheets of defined...
实施日期:2012-11-29
Methods for chemical analysis of lead-free tin-based solders-Part 10:Determination of aluminum content-Electrothermal atomic absorption spectrometric method
适用范围:YS/T 746本部分规定了无铅锡基焊料中铝含量的测定方法。 本部分适用于无铅锡基焊料中铝含量的测定。测定范围:0.000 5%~0.050%。
发布日期:2010-11-22 实施日期:2011-03-01
Methods for chemical analysis of lead-free tin-based solders-Part 12:Determination of Indium content-Na2 EDTA titrimetric method
适用范围:本部分规定了无铅锡基焊料中铟含量的测定方法。 本部分适用于无铅锡基焊料中铟含量的测定。测定范围:20.00%~60.00%。
发布日期:2010-11-22 实施日期:2011-03-01
Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammabi...
发布日期:2013-04-30 实施日期:2013-04-30
Materials for printed boards and other interconnecting structures. Part 2-38:Reinforced base materials,clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (ve...
发布日期:2008-11-27 实施日期:2008-11-27
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (verti...
实施日期:2009-07-01
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Part 2:Mitigation of deleterious effects of tin
适用范围:IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to...
发布日期:2012-11-29 实施日期:2012-11-29
Automotive fuels - Unleaded petrol - Requirements and test methods
实施日期:2008-11-01
Standard Specification for Free-Cutting Bismuth Brass Rod,Bar and Wire
实施日期:2012-10-01
Methods for chemical analysis of lead-free tin-based solders-Part 7:Determination of iron content-Flame atomic absorption spectrometric method
适用范围:本部分规定了无铅锡基焊料中铁含量的测定方法。 本部分适用于无铅锡基焊料中铁含量的测定。测定范围:0.0010%~0.150% 。
发布日期:2010-11-22 实施日期:2011-03-01
Standard Specification for Unleaded Aviation Gasoline Containing a Non-hydrocarbon Component
实施日期:2012-04-15
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