Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Part 23:Rework and repair guidance to address the implications of lead-free electronics and mixed ...
发布日期:2013-10-07 实施日期:2013-10-07
Methods for chemical analysis of tin-based lead-free solders-Part 3:Determination of copper content-Flame atomic absorption spectrometric method and sodium thiosulfate titrimetric method
发布日期:2010-11-22 实施日期:2011-03-01
Methods for chemical analysis of tin-based lead-free solders-Part 13:Determination of nickel content-Flame atomic absorption spectrometric method
发布日期:2010-11-22 实施日期:2011-02-13
General technological specifcation for lead-free wavesoldering
实施日期:2008-07-01
Materials for printed boards and other interconnecting structures. Part 4-19:Sectional specification set for prepreg materials,unclad (for the manufacture of multilayer boards). High performance non-ha...
发布日期:2013-11-04 实施日期:2013-11-04
Methods for chemical analysis of lead-free tin-based solders-Part 7:Determination of iron content-Flame atomic absorption spectrometric method
发布日期:2010-11-22 实施日期:2011-03-01
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of def...
发布日期:2013-09-01 实施日期:2013-09-01
General technological specification for lead-free reflow soldering
实施日期:2008-07-01
Verbindungsmaterialien für Baugruppen der Elektronik. Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das L?ten von Elektronikprodukten Attachment materials for electr...
实施日期:2007-07-31
Automotive fuels. Assessment of petrol and diesel fuel quality. Sampling from retail site pumps and commercial site fuel dispensers
发布日期:2013-03-31 实施日期:2013-03-31
Liquid petroleum products - Unleaded petrol - Determination of organic oxygenate compounds and total organically bound oxygen content by gas chromatography using column switching
Methods for chemical analysis of lead-free tin-based solders-Part 4:Determination of lead content-Flame atomic absorption spectrometric method
发布日期:2010-11-22 实施日期:2011-03-01
Methods for chemical analysis of lead-free tin-based solders-Part 6:Determination of antimony content-Flame atomic absorption spectrometric method
发布日期:2010-11-22 实施日期:2011-03-01
请选择需要导出的字段:
请选择需要导出的字段:
知识产权声明 | 服务承诺 | 联系我们 | 人才招聘 | 客户服务 | 关于我们
互联网出版许可证:新出网证(京)字042号 互联网药品信息服务资格证书号:(京)-经营性-2011-0017 信息网络传播视听节目许可证 许可证号:0108284
京ICP证:010071 京公网安备11010802020237号 京ICP备08100800号-1
客服电话:4000115888 客服邮箱:service@wanfangdata.com.cn 违法和不良信息举报电话:4000115888 举报邮箱:problem@wanfangdata.com.cn 举报专区:https://www.12377.cn
万方数据知识服务平台--国家科技支撑计划资助项目(编号:2006BAH03B01)©北京万方数据股份有限公司 万方数据电子出版社