Mechanical structures for electronic equipment - Tests for IEC 60917 and 60297 - Part 2: Seismic tests for cabinets and racks
发布日期:2011-08-25 实施日期:2011-08-25
CORRIGENDUM 1 Explosive atmospheres. Part 0:Equipment. General requirements
Examination Specification for China Metrology Certification-Fuel Dispensers
发布日期:2013-02-16 实施日期:2013-08-16
Specification for front locking device-type A of avionics cases
发布日期:2007-07-14 实施日期:2007-12-01
Mechanical standardization of semiconductor devices. Part 6-17:General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages....
发布日期:2011-01-27 实施日期:2011-01-01
Piezoelectric devices. Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection. General rules
实施日期:2012-07-01
Specification for front locking device-type B of avionics cases
发布日期:2007-07-14 实施日期:2007-12-01
Methods of measurement for radio transmitters--Part 7: Cabinet radiation at frequencies above 1GHz
实施日期:1987-12-17
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitc...
发布日期:2011-06-08 实施日期:2011-06-08
Modular order for the development of mechanical structures for electronic equipment practices. Part 2-5:Sectional specification. Interface co-ordination dimensions for the 25 mm equipment practice. Cab...
实施日期:2012-07-01
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