DIN EN 61076-4-108-2002

电子设备用连接器 第4-108部分:有质量评定的印制电路板接插件 模数节距25mm、具有IEC 60917-1规定2.5 mm基本网格、可用于15 mm侧向填充密度的集成屏蔽功能的电缆与板连接件的详细规范

Connectors for electronic equipment - Part 4-108: Printed board connectors with assessed quality; Detail specification for cable-to-board connectors, with a modular pitch of 25 mm and integrated shield...

实施日期：2002-12-01

EN 60191-6-16-2007

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

DIN EN ISO 19115-2-2010

地理信息 元数据 第2部分:图像和栅格数据的扩展

Geographic information - Metadata - Part 2: Extensions for imagery and gridded data

适用范围：This part of ISO 19115 extends the existing geographic metadata standard by defining the schema required for describing imagery and gridded data.

实施日期：2010-05-01

BS EN 61076-4-110-2002

电子设备连接器 第4-110部分:质量经评定的印制板连接器 具有基本网格为2,0mm的带锁存电缆连接器的详细规则,包括完全屏蔽和锁存功能

Steckverbinder fuer elektronische Einrichtungen. Steckverbinder fuer gedruckte Schaltungen mit bewerteter Qualitaet. Bauartspezifikation fuer ein verriegelbares Kabelsteckverbindersystem,Raster 2,0 mm,...

适用范围：Connectors for electronic equipment —Part 4-110: Printed board connectors with assessed quality —Detail specification for latched cable connector system having a basic grid of 2,0 mm including full shi...

实施日期：2002-03-22

DIN EN 60191-6-13-2008

半导体器件的机械标准化 第6-13部分:细间距球栅阵列和细间距基板栅格阵列(FBGA/FLGA)用敞顶型插座的设计指南

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

实施日期：2008-04-01

DIN EN ISO 19123-2007

Geographic information - Schema for coverage geometry and functions (ISO 19123:2005)

实施日期：2007-06-01

IEC 61947-2-2001

电子投影 主要性能标准的测量和文件编制 第2部分:可变分辨率投影仪

Electronic projection - Measurement and documentation of key performance criteria - Part 2: Variable resolution projectors

适用范围：IEC 61947-2:2001 specifies requirements for measuring and documenting key performance parameters for CRT and laser-based projectors and other variable resolution projectors that are capable of multiple...

发布日期：2001-09-17  实施日期：2001-09-17

IEC 60917-1-1998

电子设备用机械结构设计的模型化规则 第1部分:通用标准

Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard

适用范围：Gives the definitions of a modular order for mechanical structures of electronic equipment and provides for dimensional compatibility at mechanical interfaces with related engineering applications.

发布日期：1998-09-17  实施日期：1998-09-17

EN 61076-4-102-1997

Connectors with Assessed Quality, for Use in d.c., Low-Frequency Analogue and in Digital High Speed Data Applications Part 4: Printed Board Connectors Section 102: Detail Specification for Two-Part Single-Pole Connectors, for Multiple Uses on Plug-In Units, with Pre-Centring, Coding and Early Mating Features, Having a Metric Grid in Accordance with IEC 60917 IEC 61076-4-102: 1997

DIN EN 60191-6-16-2007

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

实施日期：2007-11-01

NF C93-430-8-1998

Connectors for frequencies below 3 MHz for use with printed boards. Part 8 : two-parts connectors for printed boards, for basic grid of 2,54 mm (0,1 in) with square male contacts of 0,63 mm X 0,63 mm.

NF C93-406-4-108-2004

Connectors for electronic equipment - Part 4-108 : printed board connectors with assessed quality - Detail specification for cable-to-board connectors, with a modular pitch of 25 mm and integrated shielding function, applicable for transverse packing den

BS EN 60191-6-16-2007

Mechanische Normung von Halbleiterbauelementen. Glossar für Fassungen für die Prüfung und Voralterung von BGA,LGA,FBGA und FLGA Mechanical standardization of semiconductor devices. Part 6-16:Glossary of semiconductor tests and burn-in sockets for BGA,LGA,FBGA and FLGA Normalisation mécanique des dispositifs. semi-conducteurs Glossaire des supports de test et de déverminage pour les BGA,LGA,FBGA et FLGA

实施日期：2007-07-31

IEC 60191-6-12-2011

半导体器件的机械标准化 第6-12部分:表面安装半导体器件封装外形图绘制的一般规则 矩形细间距基板栅格阵列的设计指南

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitc...

适用范围：IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition inc...

发布日期：2011-06-08  实施日期：2011-06-08

IEC 61076-4-111-2002

电子设备用连接器 第4-111部分:有质量评定的印制板连接器 符合IEC 60917-1的基本网格为2.5mm、有预插合特性的印制板和底板用两件式电源连接器组件的详细规范

Connectors for Electronic Equipment. Part 4-111:Printed Board Connectors with Assessed Quality. Detail Specification for Two-Part Power Connector Modules,for Printed Boards and Backplanes Having Early ...

适用范围：Connectors for electronic equipment -Part 4-111:Printed board connectors with assessed quality -Detail specification for two-part power connector modules, for printed boards and backplanes having early...

实施日期：2002-02-01

NF C96-013-6-13-2008

Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA).

ISO 12647-5-2001

印刷技术 网目调分色片、样张和印刷成品的加工过程控制 第5部分:丝网印刷

Graphic technology -- Process control for the manufacture of half-tone colour separations, proof and production prints -- Part 5: Screen printing

适用范围：This part of ISO 12647 specifies a number of process parameters and their values to be applied when preparing colour separations for four-colour screen process printing when producing four-colour proof...

发布日期：2001-12-01  实施日期：2001-12-01

IEC 60191-6-20-2010

半导体器件的机械标准化 第6-20部分:表面安装半导体器件封装外形图绘制的一般规则 小型J形引线封装(SOJ)的封装尺寸测量方法

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package d...

适用范围：IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

发布日期：2010-08-30  实施日期：2010-08-30

BS ISO 12647-5-2001

图形技术 半音色分隔物,校样和印刷物制造的过程控制 第5部分:丝网印刷术语

Graphic technology. Process control for the manufacture of half-tone colour separations, proof and production prints. Screen printing

适用范围：— is directly applicable to proofing and printing from printing surfaces produced by filmless methods and to gravure printing as long as direct analogies to film production systems are maintained;

EN 60097-1993

Grid Systems for Printed Circuits (Incorporates Corrigendum January 1993) (IEC 97:1991)