Umweltpruefungen. Pruefungen. Pruefung Td. Pruefverfahren fuer Loetbarkeit,Widerstandsfaehigkeit gegenueber Aufloesen der Metallisierung und Loetwaermebestaendigkeit bei oberflaechenmontierbaren Bauele...
适用范围:This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys contai...
实施日期:2004-11-19
适用范围:本标准等同采用国际电工委员会IEC68-2-58《环境试验 第2部分:试验方法 试验 Td:表面组装器件的可焊性、金属化层耐熔蚀性和耐焊接热》(1989年第1版)。
实施日期:1999-05-01
发布日期:2013-05-07 实施日期:2013-05-07
Environmental testing - Part 2-58: Tests; test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:200...
适用范围:This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder allays contai...
实施日期:2005-03-01
Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-58:2004
发布日期:2004-10-01 实施日期:2004-10-01
Test methods for electrical materials,printed boards and other interconnection structures and assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys
发布日期:2013-07-31 实施日期:2013-07-31
Environmental testing - Part 2-58 : tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD).
The code of the welding heat treatment for power plant
发布日期:2002-04-27 实施日期:2002-09-01
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