DIN EN 60068-2-54-2007

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006)

实施日期：2007-01-01

EN 50491-2-2010

General requirements for Home and Building Electronic Systems (HBES) and Building Automation and Control Systems (BACS) - Part 2: Environmental conditions

IEEE 1101.10-1996

使用IEEE Std 1101.1-1991设备实施规范的微型计算机附加机械规范

Standard for Additional Mechanical Specifications for Microcomputers Using the IEEE Std 1101.1-1991 Equipment Practice IEEE Computer Society Document

DIN EN 60068-2-58-2005

环境试验 第2-58部分:试验:试验Td 可焊接表面安装设备耐金属化溶解性和耐焊接热能力

Environmental testing - Part 2-58: Tests; test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:200...

适用范围：This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder allays contai...

实施日期：2005-03-01

BS EN ISO 16484-2-2004

建筑物自动化和控制系统.硬件

Systeme der Gebaeudeautomation (GA). Hardware Building automation and control systems (BACS) Part 2:Hardware Systemes de gestion technique du batiment. Equipement

适用范围：ISO 16484-2:2004 specifies the requirements for the hardware to perform the tasks within a building automation and control system (BACS). It provides the terms, definitions and abbreviations for the un...

实施日期：2004-08-11

IECQ 01A-2013

电子元器件的IEC质量评定体系(IECQ体系) IECQ导则 IECQ标记和IECQ合格标志得使用指南

IEC Quality Assessment System for Electronic Components (IECQ System). IECQ Guide. Guidance for the use of the IECQ Logo and IECQ Mark of Conformity

发布日期：2013-05-31  实施日期：2013-05-31

EN 61076-6-2004

Connectors for electronic equipment Part 6: Loose part contacts - Sectional specification IEC 61076-6:2004

DIN 41850-2-1985

膜集成电路；材料；导线糊剂的评定方法

Film and hybrid integrated circuits; materials, methods for the assessment of conductive pastes

适用范围：The standard describes those procedures, which are necessary to assess the ability and reliability of conductive pastes to be used for integrated film circuits. The testing of the characteristics of th...

NF C01-581/A1-1999

NF C01-581-1982的修改件1

IEC 60749-26-2006

半导体器件 机械和气候试验方法 第26部分:静电放电(ESD)灵敏度试验 人体模型(HBM)

Semiconductor devices. Mechanical and climatic test methods. Part 26:Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM) Dispositifs. semiconducteurs. Méthodes d'essais mécaniques...

适用范围：This part of IEC 60749 establishes a standard procedure for testing and classifyingsemiconductor devices according to their susceptibility to damage or degradation by exposureto a defined human body mo...

发布日期：2006-07-18  实施日期：2006-07-01

DIN EN 60044-8-2003

互感器 第8部分:电子电流互感器

Instrument transformers - Part 8: Electronic current transformers

实施日期：2003-06-01

IEC 60286-3-2007

自动装配用元件的包装 第3部分:表面安装的元件在连续编带上的包装

Packaging of components for automatic handling. Part 3:Packaging of surface mount components on continuous tapes Emballage de composants pour opérations automatisées. Partie 3:Emballage des composants ...

适用范围：This part of IEC 60286 is applicable to the (ape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those d...

实施日期：2007-06-01

DIN 45910-28-1991

电子元件质量评估协调体系.分规范.第28部分:带金属处理电极和直电流用聚乙烯对苯二酸盐介质的片状固定电容器

Harmonized system of quality assessment for electronic components; sectional specification: fixed chip capacitors with metallized electrodes and polyethylene-terephthalate dielectric for direct current...

适用范围：Harmonized system of quality assessment for electronic components; sectional specification: fixed chip capacitors with metallized electrodes and polyethylene-terephthalate dielectric for direct current...

DIN 47104-1988

通信软线用箔皮束绞导电线

Tinselwire for telecommunication cords

适用范围：This standard is for tinselwire for telecommunication.

IEC/TS 62647-22-2013

无铅焊料的航空航天和国防电子系统技术指南

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Technical guidelines

发布日期：2013-09-25  实施日期：2013-09-25

DIN EN 60939-2-2006

抑制电磁干扰用无源滤波器 第2部分:分规范:规定安全试验的无源滤波器 试验方法和一般要求

Passive filter units for electromagnetic interference suppression - Part 2: Sectional specification: Passive filter units for which safety tests are appropriate - Test methods and general requirements

实施日期：2006-06-01

GB/T 14600-2009

电子工业用气体 氧化亚氮

Gas for electronic industry-Nitrous Oxide

适用范围：本标准规定了氧化亚氮的技术要求，试验方法以及包装、标志、贮运及安全。本标准适用于电子工业中化学气相淀积工艺。

发布日期：2009-10-30  实施日期：2010-05-01

IEC 60384-16-2005

电子设备用固定电容器 第16部分:分规范:金属化聚丙烯薄膜介质直流固定电容器

Fixed capacitors for use in electronic equipment - Part 16: Sectional specification: Fixed metallized polypropylene film dielectric d.c. capacitors

适用范围：applies to fixed capacitors with metallized electrodes and polypropylene dielectric for use in electronic equipment. These capacitors may have "self-healing properties" depending on conditions of use. ...

发布日期：2005-11-09  实施日期：2005-11-09

BS EN 61000-4-12-2006

电磁兼容性.第4部分:试验和测量方法.第12节:振荡波抗扰性试验.基本电磁性发布

Electromagnetic compatibility (EMC). Testing and measurement techniques. Ring wave immunity test

适用范围：This part of IEC 61000 relates to the immunity requirements and test methods for electrical and electronic equipment, under operational conditions, to non-repetitive damped oscillatory transients (ring...

实施日期：2007-02-28

IEC 61076-3-112-2006

电子设备用连接器 第3-112部分:矩形连接器 消费者音频/视频设备用高性能串行总线4触点矩形连接器的详细规范

Connectors for electronic equipment - Part 3-112: Rectangular connectors - Detail specification for rectangular connectors with four contacts for high performance serial bus for consumer audio/ video e...

适用范围：Lays down requirements for connectors based on IEEE standard 1394a-2000 and applicable for high performance serial bus used for consumer audio/video equipment. These connectors consist of fixed and fre...

发布日期：2006-04-27  实施日期：2006-04-27