BS EN 60749-17-2003

半导体器件 机械和气候试验方法 第17部分:中子辐射

Halbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Neutronenbestrahlung Semiconductor devices Mechanical and climatic test methods Part 17:Neutron irradiation Dispositifs a semiconducte...

实施日期：2003-06-19

BS ISO 9655-2004

电讯夹扭钳和剪切钳.专用钳.夹扭钳

Elektronikzangen. Einzweckzangen. Greifzangen Pliers and nippers for electronics Single-purpose pliers Pliers for gripping and manipulating Pinces pour l'electronique. Pinces unifonction. Pinces de ser...

实施日期：2004-12-10

DIN EN 60194-2007

Printed board design, manufacture and assembly - Terms and definitions (IEC 60194:2006); German version EN 60194:2006,text in English

实施日期：2007-03-01

DIN EN 60512-2-3-2003

电子设备用连接器 试验和测量方法 第2-3部分:电连续性和接触电阻试验 试验2c:接触电阻波动

Connectors for electronic equipment; Tests and measurements; Part 2-3: Electrical continuity and contact resistance tests; Test 2c: Contact resistance variation

实施日期：2003-01-01

DIN IEC 60747-2-2001

半导体器件.分立器件和集成电路.第2部分:整流二极管

Semiconductor devices; discrete devices and integrated circuits; rectifier diodes;

EN ISO 27874-2008

Metallic and other inorganic coatings. Electrodeposited gold and gold alloy coatings for electrical,electronic and engineering purposes. Specification and test methods

实施日期：2008-09-01

DIN EN 60821-1994

1至4字节数据的微处理系统总线

IEC-821-VMEbus - Microprocessor system bus for 1 byte to 4 byte data (IEC 60821:1991, modified); German version EN 60821:1994

DIN IEC 60384-15-1-1991

电子设备固定电容器.第15部分:分规范:固体或非固体电解质固定钽电容器.第1节:空白详细规范:非固体电解质和箔电极的固定钽电容器.评定等级 E

Fixed capacitors for use in electronic equipment; part 15: blank detail specification: fixed tantalum capacitors with non-solid electrolyte and foil electrode; assessment level E; identical with IEC 60...

EN 60068-2-70-1996

基本环境试验规程.第2部分:试验.试验Xb:抗由于手和手指磨擦引起的符号及文字的磨损的检验

Environmental Testing Part 2: Tests Test Xb: Abrasion of Markings and Letterings Caused by Rubbing of Fingers and Hands (IEC 68-2-70 : 1995)

发布日期：1996-01-16  实施日期：1996-09-01

DIN IEC 60384-12-1-1991

电子设备固定电容器.第12部分:分规范:固定聚碳酸酯薄膜介质金属箔直流电容器.第1节:空白详细规范:金属箔式聚碳酸酯薄膜介质直流固定电容器.评定等级 E

Fixed capacitors for use in electronic equipment; part 12: blank detail specification: fixed polycarbonate film dielectric metal foil d.c. capacitors; assessment level E; identical with IEC 60384-12-1:...

DIN IEC 60512-9-1994

电子设备用机电元件.基本试验规程和测量方法.第9部分:杂项试验

Electromechanical components for electronic equipment; basic testing procedures and measuring methods; part 9: miscellaneous tests; identical with IEC 60512-9:1992

GB/T 11463-1989

电子测量仪器可靠性试验

Reliability test for electronic measuring instruments

发布日期：1989-03-31  实施日期：1990-01-01

EN 61249-8-7-1996

Materials for Interconnection Structures Part 8: Sectional Specification Set for Non-Conductive Films and Coatings Section 7: Marking Legend Inks IEC 1249-8-7 : 1996

EN 61797-1-1996

Transformers and Inductors for Use in Telecommunication and Electrical Equipment - Main Dimensions of Coil Formers; Part 1: Coil Formers for Laminated Cores IEC 1797-1:1996

EN 60512-12-1-2006

Connectors for electronic equipment - Tests and measurements Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method IEC 60512-12-1:2006

EN 62386-102-2009

Digital addressable lighting interface - Part 102: General requirements - Control gear [: CENELEC EN 60929]

EN 60286-6-2004

Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting components IEC 60286-6:2004

IEC 60119-1960

关于多晶半导体整流堆和设备的推荐标准

Recommendations for Polycrystalline Semiconductor Rectifier Stacks and Equipments Recommandations pour les cellules elements redresseurs et groupes redresseurs a semiconducteurs polycristallins Edition...

实施日期：1960-01-01

IEC 60384-1-2008

电子设备用固定电容器 第1部分:总规范

Fixed capacitors for use in electronic equipment. Part 1:Generic specification Edition 4.0

实施日期：2008-07-01

IEEE 1149.4-2010

A Mixed-Signal Test Bus IEEE Computer Society

实施日期：2010-12-09