Druckfest gekapselte Versorgungs und Regeleinheiten fuer Netze bis 1100 V im Grubenbau. Leistungsschaltereinheiten Mining Type Flameproof Supply and Control Units for Use on Systems up to 1100 V Part 2...
实施日期:1993-01-01
Glassfiber Reinforced Plastic Electric Enclosure
发布日期:1986-08-03 实施日期:1986-08-03
Mechanische Normung von Halbleiterbauelementen. Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitergehaeusen. Konstruktionsleitfaden fuer Gehaeuse mit Kugel-und Saeulenansc...
实施日期:2002-03-29
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German ver...
实施日期:2010-10-01
Surface acoustic wave (SAW) filters; part 3: standard outlines (chapter IV); identical with IEC 60862-3:1986
实施日期:2004-08-01
Circular connectors; snap-in receptacle for 3,5 mm snap-in pin
CORRIGENDUM 1 Explosive atmospheres. Part 31:Equipment dust ignition protection by enclosure “t”CORRIGENDUM 1 Atmosphères explosives. Partie 31:Protection du matériel contre l’inflammation des poussièr...
实施日期:2009-03-01
发布日期:2009-12-04 实施日期:2009-12-04
A.c. switchgear and controlgear for voltages above 1 kV; cast aluminium alloy enclosures for gas-filled high- voltage switchgear and controlgear
General Requirements for Rotating Electrical Machines Part 145:Winding Terminations
实施日期:1987-01-01
Medical electrical equipment - Part 2-54: Particular requirements for the basic safety and essential performance of X-ray equipment for radiography and radioscopy
发布日期:2009-06-29 实施日期:2009-06-29
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package d...
发布日期:2010-08-30 实施日期:2010-08-30
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
发布日期:2009-11-26 实施日期:2009-11-26
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