Einrichtungen der Informationstechnik. Sicherheit. Fernspeisung Information technology equipment Safety Part 21:Remote power feeding Materiels de traitement de l'information. Securite. Telealimentation...
实施日期:2003-10-31
实施日期:2003-06-09
实施日期:2009-01-31
Health informatics. Security requirements for archiving of electronic health records. Guidelines
发布日期:2010-02-01 实施日期:2010-02-01
Industrial communication networks - Fieldbus specifications - Part 5-15: Application layer service definition - Type 15 elements
发布日期:2010-08-05 实施日期:2010-08-05
Industrial communication networks - Fieldbus specifications - Part 5-21: Application layer service definition - Type 21 elements
发布日期:2010-08-06 实施日期:2010-08-06
Operation and maintenance regulation of digital microwave transmission link for radio and TV
发布日期:2010-08-02 实施日期:2010-08-02
Low-voltage electrical installations - Part 4-44: Protection for safety - Protection against voltage disturbances and electromagnetic disturbances
发布日期:2007-08-14 实施日期:2007-08-14
Semiconductor Devices. Mechanical and Climatic Test Methods. Part 2:Low Air Pressure CORRIGENDUM 1
实施日期:2003-08-01
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of def...
发布日期:2005-09-05 实施日期:2005-09-05
Intelligent transport systems -- Communications access for land mobiles (CALM) -- Mobile wireless broadband using IEEE 802.16
发布日期:2010-03-01 实施日期:2010-03-01
Information technology -- UPnP Device Architecture -- Part 5-12: Digital Security Camera Device Control Protocol - Digital Security Camera Still Image Service
发布日期:2008-11-01 实施日期:2008-11-01
Connectors for use in d.c. low-frequency analogue and digital high speed data applications - Part 4-103: Printed board connectors with assessed quality - Detail specification for two-part connectors wi...
发布日期:1999-02-26 实施日期:1999-02-26
Materials for printed boards and other interconnecting structures. Part 2-39:Reinforced base materials clad and unclad. High performance epoxide and non-epoxide,woven E-glass laminate sheets of defined...
实施日期:2012-11-29
Semiconductor Devices. Mechanical and Climatic Test Methods. Part 12:Vibration,Variable Frequency Dispositifs A Semiconducteurs. Methodes D′essais Mecaniques et Climatiques. Partie 12:Vibrations,Freque...
实施日期:2002-04-01
Industrial communication networks - Fieldbus specifications - Part 4-7: Data-link layer protocol specification - Type 7 elements
发布日期:2007-12-14 实施日期:2007-12-14
General principles of measuring methods of horizontal and vertical sweep circuit for semiconductor TV integrated circuits ...
实施日期:1997-01-01
发布日期:1996-01-31 实施日期:1996-01-31
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