Specification for metrology pattern cells for integrated circuit manufacture
适用范围:本规范规定若干种标准测试图形,用以对集成电路生产中所用的微图形设备、计量仪器和工艺进行一致的全面评估和检测。 本规范针对线宽计量、分辨率测试和邻近效应测试的需要,规定若干种基本测试图形单元的形状、一般尺寸、以...
发布日期:1997-06-20 实施日期:1998-03-01
Identification cards -- Integrated circuit card programming interfaces -- Part 5: Testing procedures
适用范围:ISO/IEC 24727 is a set of programming interfaces for interactions between integrated circuit cards and external applications to include generic services for multi-sector use. ISO/IEC 24727-5:2011 speci...
发布日期:2011-03-01 实施日期:2011-03-01
Berechnung von Verzoegerung und Leistungsaufnahme beim Entwurf von Chips. System zur Berechnung von Verzoegerung und Leistungsaufnahme integrierter Schaltkreise (IC) Delay and Power Calculation Standar...
适用范围:Electronic engineering, Integrated circuits, Computerized control, Design, Interfaces (data processing), Information exchange
实施日期:2002-03-08
Halbleiterbauelemente. Pruefplan fuer die Technikanerkennung (Technology Approval Schedule-TAS) fuer monolithische integrierte Mikrowellenschaltkreise Semiconductor devices Part 16-10:Technology Approv...
适用范围:This TAS specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture and supply of monolithic microwa...
实施日期:2004-11-09
Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
适用范围:IEC 60747-16-10:2004 specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture and supply of monoli...
发布日期:2004-07-15 实施日期:2004-07-15
Semiconductor integrated circuits--Specification for stamped leadframes of plastic DIP
适用范围:本规范规定了半导体集成电路塑料双列封装冲制型引线框架(以下简称引线框架)的技术要求及检验规则。 本规范适用于双列(DIP)冲制型引线框架,单列冲制型引线框架亦可参照使用。
发布日期:1993-01-21 实施日期:1993-08-01
Connectors for electronic equipment - Part 4-114: Printed board connectors - Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1,5 mm
适用范围:Describes modular two-part connectors with integrated shielded function having a grid of 1 mm × 1,5 mm in accordance with IEC 60917-1
发布日期:2003-02-26 实施日期:2003-02-26
Leiterplatten und Flachbaugruppen. Konstruktion und Anwendung. Betrachtungen zur Montage (Anschlussflaeche/Verbindung). Bauelemente mit J-foermigen Anschluessen auf vier Seiten Printed boards and print...
适用范围:This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. The object of this standard is to provide the...
实施日期:2003-06-26
Terminology of packages for semiconductor inte-grated circuits
适用范围:本标准规定了半导体集成电路封装在生产制造、工程应用和产品交验等方面使用的基本术语。 本标准适用于与半导体集成电路封装相关的生产、科研、教学和贸易等方面的应用。
发布日期:1993-01-21 实施日期:1993-08-01
Berechnung von Verzoegerung und Leistungsaufnahme beim Entwurf von Chips. Vorgezogene Berechnung der Verzoegerung fuer CMOS-ASIC-Bibliotheken Delay and power calculation standards Part 2:Pre-layout del...
适用范围:This standard specifies the pre-layout delay calculation method for CMOS1 ASIC Libraries which contains cell based primitives and memories to be used during the pre-layout design phase of Logic simulat...
实施日期:2002-09-27
Connectors for electronic equipment - Part 4-114: Printed board connectors; Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1.5 mm
实施日期:2004-01-01
Quartz crystal units for frequency control and selection; part 2: guide to use of quartz crystal units for frequency control and selection; Section one: quartz crystal units for microprocessor clock su...
适用范围:The document contains a guide to use of quartz crystal units for frequency control and selection.
Semiconductor devices. Microwave integrated circuits. Oscillators
发布日期:2013-09-30 实施日期:2013-09-30
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides
适用范围:This standard provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides.
实施日期:2003-10-01
Guidelines for photomask defect classification and size definition
适用范围:本准则的范围是制定有关光掩模缺陷分类用的标准术语,并规定缺陷大小的表达方法。确定光掩模缺陷时应遵循这个准则。
发布日期:1997-06-20 实施日期:1998-03-01
Steckverbinder fuer elektronische Einrichtungen. Steckverbinder fuer gedruckte Schaltungen. Bauartspezifikation fuer indirekte Steckverbinder mit integrierter Schirmung im Raster 1 mm x 1,5 mm Connecto...
适用范围:Connectors for electronic equipment —Part 4-114: Printed board connectors —Detail specification for two-part connector with integrated shielding function having a grid of 1 mm × 1,5 mm 1 General da...
实施日期:2003-06-23
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