Specification for metrology pattern cells for integrated circuit manufacture
适用范围：本规范规定若干种标准测试图形，用以对集成电路生产中所用的微图形设备、计量仪器和工艺进行一致的全面评估和检测。 本规范针对线宽计量、分辨率测试和邻近效应测试的需要，规定若干种基本测试图形单元的形状、一般尺寸、以...
发布日期：1997-06-20 实施日期：1998-03-01
Identification cards -- Integrated circuit card programming interfaces -- Part 5: Testing procedures
适用范围：ISO/IEC 24727 is a set of programming interfaces for interactions between integrated circuit cards and external applications to include generic services for multi-sector use. ISO/IEC 24727-5:2011 speci...
发布日期：2011-03-01 实施日期：2011-03-01
Berechnung von Verzoegerung und Leistungsaufnahme beim Entwurf von Chips. System zur Berechnung von Verzoegerung und Leistungsaufnahme integrierter Schaltkreise (IC) Delay and Power Calculation Standar...
适用范围：Electronic engineering, Integrated circuits, Computerized control, Design, Interfaces (data processing), Information exchange
实施日期：2002-03-08
Halbleiterbauelemente. Pruefplan fuer die Technikanerkennung (Technology Approval Schedule-TAS) fuer monolithische integrierte Mikrowellenschaltkreise Semiconductor devices Part 16-10:Technology Approv...
适用范围：This TAS specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture and supply of monolithic microwa...
实施日期：2004-11-09
Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
适用范围：IEC 60747-16-10:2004 specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture and supply of monoli...
发布日期：2004-07-15 实施日期：2004-07-15
Semiconductor integrated circuits--Specification for stamped leadframes of plastic DIP
适用范围：本规范规定了半导体集成电路塑料双列封装冲制型引线框架(以下简称引线框架)的技术要求及检验规则。 本规范适用于双列(DIP)冲制型引线框架，单列冲制型引线框架亦可参照使用。
发布日期：1993-01-21 实施日期：1993-08-01
Connectors for electronic equipment - Part 4-114: Printed board connectors - Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1,5 mm
适用范围：Describes modular two-part connectors with integrated shielded function having a grid of 1 mm × 1,5 mm in accordance with IEC 60917-1
发布日期：2003-02-26 实施日期：2003-02-26
Leiterplatten und Flachbaugruppen. Konstruktion und Anwendung. Betrachtungen zur Montage (Anschlussflaeche/Verbindung). Bauelemente mit J-foermigen Anschluessen auf vier Seiten Printed boards and print...
适用范围：This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. The object of this standard is to provide the...
实施日期：2003-06-26
Terminology of packages for semiconductor inte-grated circuits
适用范围：本标准规定了半导体集成电路封装在生产制造、工程应用和产品交验等方面使用的基本术语。 本标准适用于与半导体集成电路封装相关的生产、科研、教学和贸易等方面的应用。
发布日期：1993-01-21 实施日期：1993-08-01
Berechnung von Verzoegerung und Leistungsaufnahme beim Entwurf von Chips. Vorgezogene Berechnung der Verzoegerung fuer CMOS-ASIC-Bibliotheken Delay and power calculation standards Part 2:Pre-layout del...
适用范围：This standard specifies the pre-layout delay calculation method for CMOS1 ASIC Libraries which contains cell based primitives and memories to be used during the pre-layout design phase of Logic simulat...
实施日期：2002-09-27
Connectors for electronic equipment - Part 4-114: Printed board connectors; Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1.5 mm
实施日期：2004-01-01
Quartz crystal units for frequency control and selection; part 2: guide to use of quartz crystal units for frequency control and selection; Section one: quartz crystal units for microprocessor clock su...
适用范围：The document contains a guide to use of quartz crystal units for frequency control and selection.
Semiconductor devices. Microwave integrated circuits. Oscillators
发布日期：2013-09-30 实施日期：2013-09-30
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides
适用范围：This standard provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides.
实施日期：2003-10-01
Guidelines for photomask defect classification and size definition
适用范围：本准则的范围是制定有关光掩模缺陷分类用的标准术语，并规定缺陷大小的表达方法。确定光掩模缺陷时应遵循这个准则。
发布日期：1997-06-20 实施日期：1998-03-01
Steckverbinder fuer elektronische Einrichtungen. Steckverbinder fuer gedruckte Schaltungen. Bauartspezifikation fuer indirekte Steckverbinder mit integrierter Schirmung im Raster 1 mm x 1,5 mm Connecto...
适用范围：Connectors for electronic equipment —Part 4-114: Printed board connectors —Detail specification for two-part connector with integrated shielding function having a grid of 1 mm × 1,5 mm 1 General da...
实施日期：2003-06-23
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