BS EN 60512-12-4-2006

Steckverbinder fuer elektronische Einrichtungen. Mess-und Pruefverfahren. Pruefungen der Loetbarkeit. Pruefung 12d. Loetwaermebestaendigkeit,Loetbadverfahren Connectors for electronic equipment. Tests and measurements. Part 12-4:Soldering tests. Test 12d:Resistance to soldering heat,solder bath method Connecteurs pour equipements electroniques. Essais et measures. Essais de soudure. Essai 12d. Resistance a la chaleur de soudage,methode de bain de brasage CORR 16984:March 30,2007

实施日期：2006-04-28

IEC 62391-1-2006

电子设备用固定双层电容器 第1部分:总规范

Fixed electric double-layer capacitors for use in electronic equipment. Part 1:Generic specification Edition 1

实施日期：2006-04-01

NF C96-022-20-2010

Semiconductor devices - Mechanical and climatic test methods - Part 20 : resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat.

NF C20-758-2005

环境试验.试验方法.试验Td:可焊性.表面装配电路元件的金属喷镀耐溶性和焊接耐热性

Environmental testing - Part 2-58 : tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD).

IEC/TR 60068-3-12-2007

环境试验 第3-12部分:支持文件和指南 评估可能发生的无铅焊料回流温度曲线方法

Environmental testing. Part 3-12:Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profil

实施日期：2007-03-01

BS EN 60068-2-20-2008

Environmental testing. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads

实施日期：2009-01-31

IEC 60068-2-20-2008

环境试验 第2-20部分:试验 试验T:带导线设备耐锡焊热和可焊性的试验方法

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

发布日期：2008-07-21  实施日期：2008-07-21

DIN EN 62391-1-2007

Fixed electric double-layer capacitors for use in electronic equipment - Part 1: Generic specification (IEC 62391-1:2006)

实施日期：2007-02-01

DIN EN 60749-20-2010

半导体器件 机械和气候试验方法 第20部分:塑料包封SMDs抗湿气和焊接热的综合效果

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

实施日期：2010-04-01

IEC 60512-12-4-2006

电子设备用连接器 试验和测量 第12-4部分:锡焊试验 试验12d:耐锡焊热,焊料槽法

Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method

发布日期：2006-02-13  实施日期：2006-02-13

IEC 60749-20-2008

半导体器件 机械和气候试验方法 第20部分:塑料包封SMDs抗湿气和焊接热的综合效果

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

发布日期：2008-12-09  实施日期：2008-12-09

EN 60749-20-2009

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

DIN EN 60068-2-20-2009

环境试验 第2-20部分:试验 试验T:带导线设备耐锡焊热和可焊性的试验方法

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

实施日期：2009-05-01

BS EN 62391-2-2006

Elektrische Doppelschichtfestkondensatoren zur Verwendung in Geraeten der Elektronik. Rahmenspezifikation. Elektrische Doppelschichtfestkondensatoren fuer Leistungsanwendungen Fixed electric double-layer capacitors for use in electronic equipment Part 2:Sectional specification Electric double-layer capacitors for power application Condensateurs electriques fixes a double couche utilises dans les equipements electroniques. Specification intermediaire. Condensateurs electriques fixes a double couc

实施日期：2006-06-30

NF C96-022-20-1-2009

Semiconductor devices - Mechanical and climatic test methods - Part 20-1 : handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat.

EN 60512-12-4-2006

Connectors for electronic equipment - Tests and measurements Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method IEC 60512-12-4:2006

EN 60068-2-44-1995

环境试验.第2部分:试验导试验T:锡焊(IEC 68-2-68-1994)

Environmental Testing Part 2: Tests Guidance on Test T: Soldering (IEC 68-2-44 : 1995)

发布日期：1995-03-01  实施日期：1995-03-01

BS EN 60749-20-1-2009

Halbleiterbauelemente. Mechanische und klimatische Prüfverfahren. Handhabung,Verpackung,Kennzeichnung und Transport oberfl?chenmontierbarer Bauelemente,die empfindlich gegen die Kombination von Feuchte und L?tw?rme sind Semiconductor devices. Mechanical and climatic test methods. Part 20-1:Handling,packing,labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Dispositifs. semiconducteurs. Méthodes d'essais mécaniques et climatiques. Manip

实施日期：2009-07-31

BS EN 60749-20-2009

半导体器件 机械和气候试验方法 第20部分:塑料封装半导体器件抗湿气和焊接热的综合效应

Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

实施日期：2010-01-31

IEC 62391-2-2006

电子设备用固定双层电容器 第2部分:分规范 电力用双层电容器

Fixed electric double-layer capacitors for use in electronic equipment - Part 2: Sectional specfication - Electric double layer capacitors for power application

发布日期：2006-04-10  实施日期：2006-04-10