IEC 60191-6-2009

半导体器件的机械标准化 第6部分:表面安装半导体器件封装外形图绘制的一般规则

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

发布日期：2009-11-26  实施日期：2009-11-26

IEC 60191-6-20-2010

半导体器件的机械标准化 第6-20部分:表面安装半导体器件封装外形图绘制的一般规则 小型J形引线封装(SOJ)的封装尺寸测量方法

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package d...

发布日期：2010-08-30  实施日期：2010-08-30

NF C96-013-6-2-2002

Mechnical standardization of semiconductor devices - Part 6-2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

NF C20-758-2005

环境试验.试验方法.试验Td:可焊性.表面装配电路元件的金属喷镀耐溶性和焊接耐热性

Environmental testing - Part 2-58 : tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD).

DIN EN 62137-1-2-2008

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

实施日期：2008-02-01

SJ/T 11288-2003

电子设备用固定电感器 第2-1部分：空白详细规范 表面安装电感器 评定水平E

Fixed inductors for use in electronic equipment Part 2-1:Blank detail specification surface mounting inductors-Assessment level E

发布日期：2003-06-04  实施日期：2003-10-01

BS EN 60384-22-2012

Fixed capacitors for use in electronic equipment. Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric,Class 2

发布日期：2012-04-30 

IEC 60384-21-1 CORR 1-2004

Fixed capacitors for use in electronic equipment. Part 21-1:Blank detail specification:Fixed surface mount multilayer capacitors of ceramic dielectric,Class 1. Assessment level EZ CORRIGENDUM 1 First Edition

实施日期：2004-09-01

EN 61191-1-1998

Printed Board Assemblies Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies IEC 61191-1:1998

DIN EN 60749-20-2010

半导体器件 机械和气候试验方法 第20部分:塑料包封SMDs抗湿气和焊接热的综合效果

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

实施日期：2010-04-01

EN 60286-6-2004

Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting components IEC 60286-6:2004

IEC 61191-4-1998

印制板组装 第4部分:分规范 引出端焊接组装的要求

Printed Board Assemblies. Part 4:Sectional Specification. Requirements for Terminal Soldered Assemblies Ensembles De Cartes Imprimees. Partie 4:Specification Intermediaire. Exigences Relatives A L′Asse...

实施日期：1998-08-01

IEC 61188-7-2009

印制电路板和印制电路板组件 设计和使用 第7部分:CAD库结构的电子元件零定位

Printed boards and printed board assemblies. Design and use. Part 7:Electronic component zero orientation for CAD library construction Edition 1.0

实施日期：2009-05-01

IEC 60286-3-1-2009

自动装配用元件的包装 第3-1部分:表面安装的元件在连续编带上的包装 V型 加压承载编带

Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes

发布日期：2009-05-13  实施日期：2009-05-13

NF C90-730-3-2003

Workmanship requirements for soldered electronic assemblies - Part 3 : through-hole mount assemblies.

DIN EN 62490-2-2011

ESL measuring method. Part 2:Surface mount capacitors for use in electronic equipment (IEC 62490-2:2010); German version EN 62490-2:2010

BS EN 62490-2-2010

ESL-Messverfahren. Oberfl?chenmontierbare Kondensatoren zur Verwendung in Ger?ten der Elektrotechnik und Elektronik ESL measuring method Part 2:Surface mount capacitors for use in electronic equipment Méthode de mesure de l'ESL. Condensateurs pour montage en surface utilisés dans les équipements électroniques

实施日期：2010-09-30

BS EN 60384-23-1-2005

Fixed capacitors for use in electronic equipment. Blank detail specification. Fixed metallized polyethylene naphthalate film dielectric chip d.c. capacitors. Assessment level EZ

实施日期：2006-06-30

EN 60191-6-18-2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

EN 60749-20-2009

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat