DIN EN 60068-2-69-2007

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69:2007)

实施日期：2007-11-01

NF C93-112-20-1-2000

Fixed capacitors for use in electronic equipment - Part 20 : blank detail specification : fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors - Assessment level EZ.

DIN EN 62339-1-2007

Modular component interfaces for surface-mount fluid distribution components - Part 1: Elastomeric seals

实施日期：2007-11-01

EN 62025-2-2005

High frequency inductive components Non-electrical characteristics and measuring methods Part 2: Test methods for non-electrical characteristics IEC 62025-2: 2005

IEC 60393-6-1-2003

电子设备用电位器 第6-1部分:空白详细规范:表面安装预调电位器 评定水平E

Potentiometers for use in electronic equipment - Part 6-1: Blank detail specification: Surface mount preset potentiometers - Assessment level E

适用范围：A Blank Detail Specification is a supplementary document to the Sectional Specification and contains requirements for style, layout and minimum content of Detail Specifications

发布日期：2003-05-16  实施日期：2003-05-16

DIN EN 60384-21-1-2005

电子设备用固定电容器 第21-1部分:空白详细规范:表面安装四层陶瓷固定电容器,1级,评定水平EZ

Fixed capacitors for use in electronic equipment Part 21-1: Blank detail specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 Assessment level EZ First Edition; Cor...

实施日期：2005-06-01

EN 60115-9-2004

Fixed resistors for use in electronic equipment Part 9: Sectional specification - Fixed surface mount resistor networks with individually measurable resistors IEC 60115-9:2003

EN 60384-3-2006

Fixed capacitors for use in electronic equipment Part 3: Sectional specification: Surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte Incorporating corrigendum April 2009

IEC 60115-8-2009

电子设备用固定电阻器 第8部分:分规范:表面安装固定电阻器

Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors

适用范围：IEC 60115-8:2009 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (diff...

发布日期：2009-01-26  实施日期：2009-01-26

BS EN 60384-19-1-2006

Festkondensatoren zur Verwendung in Geraeten der Elektronik. Vordruck fuer Bauartspezifikation. Oberflaechenmontierbare Gleichspannungs-Kondensatoren mit metallisierter Polyethylen-Terephtalat-Folie als Dielektrikum. Qualitaetsbewertungsstufe EZ Fixed capacitors for use in electronic equipment. Part 19-1:Blank detail specification. Fixed metallized polyethyleneterephthalate film dielectric surface mount d.c. capacitors. Assessment level EZ Condensateurs fixes utilises dans les equipements electr

实施日期：2006-06-30

NF C93-112-23-2006

Fixed capacitors for use in electronic equipment - Part 23 : sectional specification - Fixed surface mount metallized polyethylene naphthalate film dielectric DC capacitors.

IEC 61191-2-1998

印制板组装 第2部分:分规范 表面安装焊接组装的要求

Printed Board Assemblies. Part 2:Sectional Specification. Requirements for Surface Mount Soldered Assemblies Ensembles De Cartes Imprimees. Partie 2:Specification Intermediaire. Exigences Relatives A L...

适用范围：This specification prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions o...

实施日期：1998-08-01

IEC 61837-2-2011

频率控制和选择用表面安装的压电器件 标准外形和端头连接 第2部分:陶瓷外壳

Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections. Part 2:Ceramic enclosures Dispositifs piézoélectriques. montage en surface po...

适用范围：IEC 61837-2:2011 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC...

发布日期：2011-05-27  实施日期：2011-05-01

DIN EN 61810-1-2009

基础机电继电器 第1部分:一般要求

Electromechanical elementary relays - Part 1: General requirements

实施日期：2009-02-01

NF C90-730-2-2003

Workmanship requirements for soldered electronic assemblies - Part 2 : surface-mount assemblies.

IEC 60384-19-2006

电子设备用固定电容器 第19部分:分规范:金属化聚乙烯-对苯二甲酸酯膜介质表面安装直流固定电容器

Fixed capacitors for use in electronic equipment. Part 19:Sectional specification. Fixed metallized polyethylene-terephthalate film dielectric surface mount d.c. capacitors Edition 2;

适用范围：The capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly onto substrates for hybrid circuits or onto printed boards. They may have "self-healing proper...

实施日期：2006-01-01

IEC 60749-30-2005

半导体器件 机械和气候试验方法 第30部分:可靠性试验前不气密的表面安装器件的预调

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

适用范围：Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-...

发布日期：2005-01-20  实施日期：2005-01-20

EN 62137-2004

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN IEC 62137:2004; Incorporates Corrigendum February 2005

BS EN 61837-4-2004

频率控制和选择用表面安装的压电器件.标准外形和端头连接器.混合外壳轮廓图

Oberflaechenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und-Selektion. Norm-Gehaeusemasse und Anschluesse. Hybridgehaeuse Surface mounted piezoelectric devices for frequency contro...

适用范围：This part of IEC 61837 specifies the outline drawings for surface mounted piezoelectric devices with hybrid enclosure outlines.

实施日期：2004-12-13

EN 60191-6-8-2001

Mechanical Standardization of Semiconductor Devices Part 6-8: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Glass Sealed Ceramic Quad Flatpack (G-QFP) IEC 60191-6-8:2001