BS EN 60384-22-2012

Fixed capacitors for use in electronic equipment. Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric,Class 2

发布日期：2012-04-30 

NF C96-022-21-2005

Semiconductor devices - Mechanical and climatic test methods - Part 21 : solderability.

IEC 62137-1-5-2009

表面安装技术 表面安装焊缝的环境和耐久性试验方法 第1-5部分:机械剪切疲劳试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

发布日期：2009-02-11  实施日期：2009-02-11

BS EN 60191-6-2-2002

半导体器件的机械标准化 第6-2部分:表面安装半导体器件封装外形图绘制的一般原则 1.50mm,1.27mm和1.00mm间距球状和柱状端子封装的设计指南

Mechanische Normung von Halbleiterbauelementen. Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitergehaeusen. Konstruktionsleitfaden fuer Gehaeuse mit Kugel-und Saeulenansc...

实施日期：2002-03-29

DIN EN 60191-6-19-2010

半导体器件的机械标准化 第6-19部分:高温时封装热变形的测量方法和最大允许热变形

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German ver...

实施日期：2010-10-01

EN 60384-21-1-2004

Fixed capacitors for use in electronic equipment Part 21-1: Blank detail specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 Assessment level EZ [Superseded: CENELEC EN 132101]

BS EN 60286-3-2-2009

Packaging of components for automatic handling. Packaging of surface mount components on continuous tapes. Type VI. Blister carrier tapes of 4 mm width

实施日期：2010-02-28

EN 61191-1-1998

Printed Board Assemblies Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies IEC 61191-1:1998

IEC 61191-4-1998

印制板组装 第4部分:分规范 引出端焊接组装的要求

Printed Board Assemblies. Part 4:Sectional Specification. Requirements for Terminal Soldered Assemblies Ensembles De Cartes Imprimees. Partie 4:Specification Intermediaire. Exigences Relatives A L′Asse...

实施日期：1998-08-01

IEC 60384-25-2006

电子设备用固定电容器 第25部分:分规范:表面安装、带导电聚合物固体电解质的铝电解固定电容器

Fixed capacitors for use in electronic equipment. Part 25:Sectional specification. Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte Edition 1.0;Corr 1:10/...

实施日期：2006-06-01

NF C20-700-2-69-2013

Environmental testing - Part 2-69 : tests - Test Te : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

NF C96-022-20-2010

Semiconductor devices - Mechanical and climatic test methods - Part 20 : resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat.

NF C93-614-2005

Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules.

NF C20-758-2005

环境试验.试验方法.试验Td:可焊性.表面装配电路元件的金属喷镀耐溶性和焊接耐热性

Environmental testing - Part 2-58 : tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD).

EN 60286-6-2004

Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting components IEC 60286-6:2004

IEC 60191-6-20-2010

半导体器件的机械标准化 第6-20部分:表面安装半导体器件封装外形图绘制的一般规则 小型J形引线封装(SOJ)的封装尺寸测量方法

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package d...

发布日期：2010-08-30  实施日期：2010-08-30

IEC 60191-6-2009

半导体器件的机械标准化 第6部分:表面安装半导体器件封装外形图绘制的一般规则

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

发布日期：2009-11-26  实施日期：2009-11-26

NF C96-013-6-2-2002

Mechnical standardization of semiconductor devices - Part 6-2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

DIN EN 60384-19 BERICHTIGUNG 1-2008

Fixed capacitors for use in electronic equipment - Part 19: Sectional specification - Fixed metallized polyethylene-terephthalate film dielectric surface mount d.c. capacitors (IEC 60384-19:2006); German version EN 60384-19:2006, Corrigendum to DIN EN 60384-19:2006-09; German version CENELEC-Cor. :2006 to EN 60384-19:2006

发布日期：2008-11-01  实施日期：2008-11-01

IEC 62490-2-2010

等效电感测量方法 第2部分:电子设备中使用的表面安装电容器

ESL measuring method - Part 2: Surface mount capacitors for use in electronic equipment

发布日期：2010-07-28  实施日期：2010-07-28