Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
发布日期:2009-02-11 实施日期:2009-02-11
Mechanische Normung von Halbleiterbauelementen. Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitergehaeusen. Konstruktionsleitfaden fuer Gehaeuse mit Kugel-und Saeulenansc...
实施日期:2002-03-29
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German ver...
实施日期:2010-10-01
Printed Board Assemblies. Part 4:Sectional Specification. Requirements for Terminal Soldered Assemblies Ensembles De Cartes Imprimees. Partie 4:Specification Intermediaire. Exigences Relatives A L′Asse...
实施日期:1998-08-01
Fixed capacitors for use in electronic equipment. Part 25:Sectional specification. Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte Edition 1.0;Corr 1:10/...
实施日期:2006-06-01
Environmental testing - Part 2-58 : tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD).
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package d...
发布日期:2010-08-30 实施日期:2010-08-30
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
发布日期:2009-11-26 实施日期:2009-11-26
发布日期:2008-11-01 实施日期:2008-11-01
ESL measuring method - Part 2: Surface mount capacitors for use in electronic equipment
发布日期:2010-07-28 实施日期:2010-07-28
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