实施日期:2007-11-01
Potentiometers for use in electronic equipment - Part 6-1: Blank detail specification: Surface mount preset potentiometers - Assessment level E
适用范围:A Blank Detail Specification is a supplementary document to the Sectional Specification and contains requirements for style, layout and minimum content of Detail Specifications
发布日期:2003-05-16 实施日期:2003-05-16
Fixed capacitors for use in electronic equipment Part 21-1: Blank detail specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 Assessment level EZ First Edition; Cor...
实施日期:2005-06-01
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
适用范围:IEC 60115-8:2009 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (diff...
发布日期:2009-01-26 实施日期:2009-01-26
Printed Board Assemblies. Part 2:Sectional Specification. Requirements for Surface Mount Soldered Assemblies Ensembles De Cartes Imprimees. Partie 2:Specification Intermediaire. Exigences Relatives A L...
适用范围:This specification prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions o...
实施日期:1998-08-01
Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections. Part 2:Ceramic enclosures Dispositifs piézoélectriques. montage en surface po...
适用范围:IEC 61837-2:2011 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC...
发布日期:2011-05-27 实施日期:2011-05-01
Electromechanical elementary relays - Part 1: General requirements
实施日期:2009-02-01
Fixed capacitors for use in electronic equipment. Part 19:Sectional specification. Fixed metallized polyethylene-terephthalate film dielectric surface mount d.c. capacitors Edition 2;
适用范围:The capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly onto substrates for hybrid circuits or onto printed boards. They may have "self-healing proper...
实施日期:2006-01-01
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
适用范围:Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-...
发布日期:2005-01-20 实施日期:2005-01-20
Oberflaechenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und-Selektion. Norm-Gehaeusemasse und Anschluesse. Hybridgehaeuse Surface mounted piezoelectric devices for frequency contro...
适用范围:This part of IEC 61837 specifies the outline drawings for surface mounted piezoelectric devices with hybrid enclosure outlines.
实施日期:2004-12-13
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