IEC 60115-8-2009

电子设备用固定电阻器 第8部分:分规范:表面安装固定电阻器

Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors

适用范围：IEC 60115-8:2009 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (diff...

发布日期：2009-01-26  实施日期：2009-01-26

BS EN 62137-1-3-2009

Oberfl?chenmontage-Technik. Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberfl?chen-L?tverbindungen. Zyklische Fallprüfung Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Part 1-3:Cyclic drop test Technologie de montage en surface. Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface. Essai de chute cyclique

实施日期：2009-03-31

BS EN 61192-3-2003

焊接电子组件的工艺要求 第2部分:穿孔安装组件

Anforderungen an die Ausfuehrungsqualitaet von Loetbaugruppen. Baugruppen in Durchsteckmontage Workmanship requirements for soldered electronic assemblies Part 3:Through-hole mount assemblies Exigences...

适用范围：This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surfac...

实施日期：2003-04-07

IEC 60286-3-2013

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

发布日期：2013-05-17  实施日期：2013-05-17

BS EN 62137-1-2-2007

Oberfl?chenmontage-Technik. Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberfl?chen-L?tverbindungen. Scherfestigkeitsprüfung Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Part 1-2:Shear strength test Technique du montage en surface. Méthodes d'essai d'environnement et d'endurance des joints de soudure pour montage en surface. Essai de résistance au cisaillement

实施日期：2007-10-31

BS EN 60068-2-58-2004

环境试验.试验方法.试验Td.软钎焊性、喷涂金属耐融化性和表面装配设备(SMD)耐焊接热的试验方法

Umweltpruefungen. Pruefungen. Pruefung Td. Pruefverfahren fuer Loetbarkeit,Widerstandsfaehigkeit gegenueber Aufloesen der Metallisierung und Loetwaermebestaendigkeit bei oberflaechenmontierbaren Bauele...

适用范围：This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys contai...

实施日期：2004-11-19

EN 62025-1-2007

High frequency inductive components - Non-electrical characteristics and measuring methods - Part 1: Fixed, surface mounted inductors for use in electronic and telecommunication equipment

EN 62137-1-3-2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

IEC 62137-1-4-2009

表面安装技术 表面安装焊缝的环境和耐久性试验方法 第1-4部分:循环弯曲试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

适用范围：The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints ...

发布日期：2009-01-26  实施日期：2009-01-26

DIN EN 61188-5-5-2008

印制电路板和印制电路板组件 设计和使用 第5-5部分:连接(连接面/接头)考虑事项 四侧面带有鸥翼形引线的元件

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

实施日期：2008-07-01

NF C93-704-1-3-2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3 : cyclic drop test.

EN 60191-6-2009

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

DIN EN 140401-801-2008

Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 0, 1; 0, 25; 0, 5; 1

实施日期：2008-05-01

BS EN 62137-1-1-2007

Oberfl?chenmontage-Technik. Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberfl?chen-L?tverbindungen. Zugfestigkeitsprüfung Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Part 1-1:Pull strength test Technique du montage en surface. Méthodes d'essai d'environnement et d'endurance des joints de soudure pour montage en surface. Essai de force d'arrachement

实施日期：2007-10-31

NF C96-022-20-1-2009

Semiconductor devices - Mechanical and climatic test methods - Part 20-1 : handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat.

IEC 60191-6-12-2011

半导体器件的机械标准化 第6-12部分:表面安装半导体器件封装外形图绘制的一般规则 矩形细间距基板栅格阵列的设计指南

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitc...

适用范围：IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition inc...

发布日期：2011-06-08  实施日期：2011-06-08

DIN EN 60191-6-19-2010

半导体器件的机械标准化 第6-19部分:高温时封装热变形的测量方法和最大允许热变形

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German ver...

实施日期：2010-10-01

EN 60749-20-2009

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

IEC 60191-6-20-2010

半导体器件的机械标准化 第6-20部分:表面安装半导体器件封装外形图绘制的一般规则 小型J形引线封装(SOJ)的封装尺寸测量方法

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package d...

适用范围：IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

发布日期：2010-08-30  实施日期：2010-08-30

BS EN 60191-6-2009

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages

实施日期：2010-04-30