IEC 60384-18-2-2007

电子设备用固定电容器 第18-2部分:空白详细规范:非固体电解质片状铝电解固定电容器 评定水平E

Fixed capacitors for use in electronic equipment - Part 18-2: Blank detail specification - Fixed aluminium electrolytic surface mount capacitors with non-solid electrolyte - Assessment level EZ

适用范围：IEC 60384-18-2:2007 is a blank detail specification and is a supplementary document to the sectional specification and contains requirements for style, layout and minimum content of detail specificatio...

发布日期：2007-03-12  实施日期：2007-03-12

IEC 61810-1-2008

基础机电继电器 第1部分:一般要求

Electromechanical elementary relays. Part 1:General requirements Edition 3.0

适用范围：This part of IEC 61810 applies to electromechanical elementary relays (non-specified time allor-nothing relays) for incorporation into equipment. It defines the basic functionalrequirements and safety-...

实施日期：2008-02-01

EN 62137-1-1-2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

DIN EN 62137-1-3-2009

表面安装技术 表面安装焊缝的环境和耐久性试验方法 第1-3部分:循环坠落试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

实施日期：2009-07-01

DIN EN 61188-5-3-2008

印制电路板和印制电路板组件 设计和使用 第5-3部分:连接(连接面/接头)考虑事项 两侧带有鸥翼形引线的元件

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

实施日期：2008-07-01

EN 60286-6-2004

Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting components IEC 60286-6:2004

DIN EN 61760-1-2006

表面安装技术 第1部分:表面安装元器件(SMDs)规范的标准方法

Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)

适用范围：This International Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usa...

实施日期：2006-10-01

IEC 61240-2012

压电器件 用于频率控制和选择的表面安装器件外形图的制备 总则

Piezoelectric devices. Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection. General rules

适用范围：This International Standard sets out general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this standard as SMD) in...

实施日期：2012-07-01

IEC 60286-6-2004

自动装配用元件的包装 第6部分:表面安装组件的散装盒包装

Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components

适用范围：is applicable to bulk case packaging capable of containing surface mounting components. The bulk case is designed for transport and storage of components and the supply of components directly or by an ...

发布日期：2004-02-05  实施日期：2004-02-05

DIN EN 140402-801-2005

空白详细规范:低功率线绕表面安装(SMD)矩形固定电阻器 0.5、1、2稳定级

Detail specification: Fixed low power wire-wound surface mount (SMD) resistors - Rectangular - Stability classes 0.5; 1; 2

适用范围：This blank detail specification is a supplementary document of the Sectional Specification and contains requirements for style and layout and minimum content of detail specifications. Detail specificat...

实施日期：2005-08-01

BS EN 140401-2009

Vordruck für Bauartspezifikation. Oberfl?chenmontierbare (SMD) Schicht-Festwiderstande niedriger Belastbarkeit Blank Detail Specification:Fixed low power film surface mount (SMD) resistors Spécification particulière cadre. Résistances fixes. couches et. faible dissipation pour montage en surface (CMS)

实施日期：2009-06-30

NF C93-704-2005

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN.

DIN EN 61240-2013

压电电器.频率控制和选择用表面安装器件(SMD)的外形图样的准备

Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 61240:2012); German version EN 61240:2012

实施日期：2013-05-01

BS EN 61188-5-8-2008

Leiterplatten und Elektronikaufbauten auf Leiterplatten. Konstruktion und Anwendung. Sektionale Anforderungen. Betrachtungen zur Montage (Landefl?che/Verbindung). Fl?chenmatrix-Bauelemente (BGA, FBGA,CGA,LGA) Printed boards and printed board assemblies. Design and use. Part 5-8:Attachment (land/joint) considerations. Area array components (BGA,FBGA,CGA,LGA) Cartes imprimées et cartes imprimées équipées. Conception et utilisation. Considérations sur les liaisons pistes-soudures. Composants matric

实施日期：2008-05-30

DIN EN 62137-1-1-2008

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

实施日期：2008-02-01

NF C93-112-22-2012

Fixed capacitors for use in electronic equipment - Part 22 : sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2.

EN 60286-3-2007

Packaging of components for automatic handling ?Part 3: Packaging of surface mount components on continuous tapes [Superseded: BSI BS EN 60286-3, BSI BS EN 60286-3]

BS EN 60384-20-1-2008

用于电气设备的固定电容器.空白详细规范:固定金属化聚苯撑硫化膜镀层表面固定直流电容器.补充级EZ

Festkondensatoren zur Verwendung in Ger?ten der Elektronik Vordruck für Bauartspezifikation. Oberfl?chenmontierbare Festkondensatoren für Gleichspannung mit metallisierter Polyphenyl-Sulfid-Folie als D...

适用范围：This British Standard is the UK implementation of EN 60384-20-1:2008. It isidentical to IEC 60384-20-1:2008. It supersedes BS EN 60384-20-1:1999 whichis withdrawn.The UK participation in its preparatio...

实施日期：2008-09-30

BS EN 61192-4-2003

焊接电子组件的工艺要求 第4部分:接头组件

Anforderungen an die Ausfuehrungsqualitaet von Loetbaugruppen. Baugruppen mit Loetstuetzpunkten Workmanship requirements for soldered electronic assemblies Part 4:Terminal assemblies Exigences relative...

适用范围：This part of IEC 61192 specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of in...

实施日期：2003-06-30

EN 61188-5-6-2003

Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides IEC 61188-5-6:2003