Semiconductor die products. Part 3:Recommendations for good practice in handling,packing and storage Produits. puces de semi-conducteurs. Partie 3:Bonnes pratiques recommandées pour la manipulation,le ...
适用范围:This technical report has been developed to facilitate the production, supply and use ofsemiconductor die products, including:– wafers,– singulated bare die,– die and wafers with attached connection st...
发布日期:2010-08-06 实施日期:2010-08-01
Packaging - Complete,filled transport packages and unit loads - Horizontal impact tests
适用范围:This standard specifies methods of horizontal impact testing (horizontal and inclined plane test and pendulum test) on a complete, filled transport package or a unit load.#,,#
Packaging. Complete, filled transport packages and unit loads. Vertical random vibration test
适用范围:Packaging, Packages, Complete and filled packages, Transportation, Vibration testing, Vibration, Vibration hazards, Strength of materials
实施日期:2002-05-10
实施日期:2007-10-01
实施日期:2007-09-28
发布日期:1999-02-17 实施日期:1999-02-17
Packaging -- Transport packaging for dangerous goods -- Plastics compatibility testing for packaging and IBCs
适用范围:ISO 13274:2013 specifies the requirements and test methods for compatibility testing of plastics packagings/Intermediate Bulk Containers (IBCs) and composite packagings/IBCs with plastics inners contai...
发布日期:2013-08-01 实施日期:2013-08-01
实施日期:2003-05-23
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