BS EN ISO 9455-6-1997

软钎焊剂.试验方法.第6部分:卤化物(不包括氟化物)的含量测定

Soft soldering fluxes. Test methods. Determination and detection of halide (excluding fluoride) content

适用范围：This part of ISO 9455 specifies three quantitative methods for the determination of the ionic halide (ex-cluding fluoride) content of soldering fluxes. Halides are calculated as chlorides. A useful qua...

GB/T 2423.32-1985

电工电子产品基本环境试验规程 润湿称量法可焊性试验方法

Basic environmental testing procedures for electric and electronic products--Solderability testing by the wetting balance method

实施日期：1986-02-01

BS 1872-1984

锡电镀层规范

Galvanische Zinnueberzuege Specification for Electroplated Coatings of Tin Depots electrolytiques d'etain. Specification

适用范围：Appearance, heat treatment, sampling and undercoats of tin coatings on fabricated articles of metal and on printed circuit boards. Classification. Requirements and test methods for thickness, adhesion,...

实施日期：1984-02-29

EN 4632-004-2012

航空航天系列 航空航天结构用焊接及铜焊组件 材料的可焊接性和可铜焊接性 第004部分:高合金钢均匀组件的焊接和钎焊

Aerospace series. Weldability and brazeability of materials in aerospace constructions. Part 004:Welding and brazing of homogeneous assemblies of high alloyed steels

实施日期：2012-09-01

ISO 9455-17-2002

软钎焊剂 试验方法 第17部分:焊剂残留物的表面绝缘电阻组合试验和电化学迁移试验

Soft soldering fluxes -- Test methods -- Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

适用范围：ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in s...

发布日期：2002-12-01  实施日期：2002-12-01

BS EN 60317-23-2014

特种绕组线规范 180级可焊接聚酰胺酯漆包圆铜线

Specifications for particular types of winding wires. Solderable polyesterimide enamelled round copper wire,class 180

发布日期：2014-02-28  实施日期：2014-02-28

BS EN 62326-4-1-1997

印制电路板.层间连接的硬性印制电路板.分规格.性能详细规格.A,B和C性能水平

Leiterplatten. Starre Mehrlagen-Leiterplatten mit Durchverbindungen Rahmenspezifikation. Bauartspezifikation zum Nachweis der Befaehigung Anforderungsstufen A,B und C Printed Boards Part 4:Rigid Multil...

适用范围：This Capability Detail Specification (Cap DS) is based on IEC 2326-4. It relates to rigid multilayer printed boards with interiayer connections manufactured with materials specified in 3.1. It specifie...

实施日期：1997-06-15

BS EN 140201-1997

电子元器件质量评定协调体系.空白详细规范.固定电源用电阻器(S 级评定)

Vordruck fuer Bauartspezifikation. Hochbelastbare Festwiderstaende (Bewertungsstufe S) Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification:Fixed Power Resistors...

适用范围：Fixed resistors, Power resistors, Resistors, Electrical components, Electronic equipment and components, Quality assurance systems, Assessed quality, Qualification approval, Approval testing, Inspectio...

实施日期：1997-09-15

GB/T 2423.32-2008

电工电子产品环境试验 第2部分：试验方法 试验Ta: 润湿称量法可焊性

Environmental testing for electric and electronic products - Part 2: Test methods - Test Ta: Solderability test by the wetting balance method

适用范围：GB/T 2423的本部分适用于确定元器件任何形状的引出端锡焊的可焊性，特别适用于仲裁试验和不能用其他方法做定量试验的元器件引出端锡焊的可焊性评定。对于表面贴装设备，如果合适应选用IEC 60068-2-69。

发布日期：2008-03-24  实施日期：2008-10-01

ASTM B813-2010

焊接铜和铜合金管用液状和糊状焊剂的规格

Standard Specification for Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube

适用范围：<p id="s00002">1.1 This specification establishes the requirements and test methods for liquid and paste fluxes for joining by soldering of copper and copper alloy tube and fittings in plumbing, heat...

实施日期：2010-04-01

BS 6137-1982

锡铅合金的电镀层规范

Spezifikation fuer galvanische Ueberzuege von Zinn-Blei-Legierungen Specification for Electroplated Coatings of Tin/Lead Alloys Specification pour les depots electrolytiques d'alliages d'etain/plomb

适用范围：Essential and additional information to be supplied to the manufacturer, classification of service conditions and coatings. Appendices give guidance notes on use and test methods.

实施日期：1982-02-26

DIN EN 60512-12-3-2006

Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting (IEC 60512-12-3:2006); German version EN 60512-12-3:2006

实施日期：2006-11-01

DIN EN ISO 3677-1995

软钎焊和硬钎焊用的填充金属.符号的规定

Filler metal for soft soldering, brazing and braze welding - Designation (ISO 3677:1992); German version EN ISO 3677:1995

DIN EN 61188-5-2-2004

印刷电路板和印制电路板组件 设计和使用 第5-2部分:安装考虑(连接面/接头) 分立件

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

适用范围：This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components.

实施日期：2004-05-01

SJ 3204-1989

软钎焊剂的名词术语

Terms for soft soldering fluxes

适用范围：本标准规定的软钎焊用焊剂的名词术语,主要供电子产品焊接技术行业使用。

发布日期：1989-02-10  实施日期：1989-03-01

NF C93-524-1981

１５０℃以下的高温绝缘电线. 一般规定

Electronic components. Insulated wires for high temperatures up to ISO grade C. General requirements.

实施日期：1981-06-01

DIN EN 60512-12-6-1996

电子设备用电子机械元件.基本试验程序和测量方法.第12部分:焊接试验.第6节:试验12f:机械焊接中耐流液和清洗溶剂的密封性

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in ma...

适用范围：The document specifies a standard test method to verify the effectiveness of the sealing of a component against flux and cleaning solvents during the machine soldering process. The result of this test ...

GB/T 29089-2012

球形焊锡粉

Spherical tin-solder powder

适用范围：本标准规定了球形焊锡粉的要求、试验方法、检验规则、标志、包装、运输和贮存、质量证明书及合同（或订货单）内容。 本标准适用于以铸造锡铅焊料、无铅锡基焊料为原料，经加工而得到的球形焊锡粉。

发布日期：2012-12-31  实施日期：2013-10-01

DIN EN 4632-001-2009

Aerospace series - Welded and brazed assemblies for aerospace constructions - Weldability and brazeability of materials - Part 001: General requirements

实施日期：2009-07-01

DIN EN 4632-006-2013

Aerospace series - Weldability and brazeability of materials in aerospace constructions - Part 006: Homogeneous assemblies of titanium alloys; German version EN 4632-006:2013

发布日期：2013-11-01  实施日期：2013-11-01