DIN EN 60512-12-7-2001

电子设备连接器.试验和测量.第12-7部分:焊接试验.试验12g,可焊性,湿平衡法

Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests; Test 12g: Solderability, wetting balance method (IEC 60512-12-7:2001); German version EN 60512-12-7:2001

适用范围：The document defines a test method to assess the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.

实施日期：2001-11-01

BS EN 60068-2-44-1995

环境试验.第2部分:试验方法.第44节:试验T指南:锡焊

Umweltpruefungen. Pruefungen. Leitfaden fuer die Pruefungen T:Loeten Environmental Testing Part 2:Tests Guidance on Test T. Soldering (IEC 68-2-44:1995) (G) Essais d'environment. Essais. Guide pour l'e...

适用范围：Provides background information and recommendations for writers of specifications containing references to standards relating to soldering and solderability.

实施日期：1995-01-01

BS 9450-1975

Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures): generic data and methods of test

GB/T 4677.10-1984

印制板可焊性测试方法

Test method of solderability for printed boards

IEC 60512-12-4-2006

电子设备用连接器 试验和测量 第12-4部分:锡焊试验 试验12d:耐锡焊热,焊料槽法

Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method

适用范围：Details a standard test method to assess the ability of a connector to withstand the heating stresses produced by a mass soldering operation.

发布日期：2006-02-13  实施日期：2006-02-13

IEC 62391-1-2006

电子设备用固定双层电容器 第1部分:总规范

Fixed electric double-layer capacitors for use in electronic equipment. Part 1:Generic specification Edition 1

适用范围：This part of IEC 62391 applies to fixed electric double layer capacitors (hereafter called "capacitor(s)") mainly used in DC circuits of electronic equipment.It establishes standard terms, inspection p...

实施日期：2006-04-01

IEC 60512-12-1-2006

电子设备用连接器 试验和测量 第12-1部分:锡焊试验 试验12a:湿焊料槽法的可焊性

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method

适用范围：Details a standard test method to assess the solderability of the terminations of a connector designed for use with printed boards or for other applications using similar soldering techniques.

发布日期：2006-03-23  实施日期：2006-03-23

IEC 60691-2002

热熔断体 要求和应用指南

Thermal-links. Requirements and application guide Protecteurs thermiques. Prescriptions et guide d'application Third Edition

适用范围： 本标准适用于安装在一般户内环境下使用的电器、电子设备及类似的组件中、用以防止它们在故障情况下出现超温的热熔断体。 注1：设备不一定是设计用来产生热量的。 注2：防止超温的有效性与热熔断体的安装位置和安装...

实施日期：2002-12-01

EN 60512-12-4-2006

Connectors for electronic equipment - Tests and measurements Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method IEC 60512-12-4:2006

DIN EN 60512-12-1-2006

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006); German version EN 60512-12-1:2006

实施日期：2006-11-01

EN 4632-005-2009

Aerospace series. Weldability and brazeability of materials in aerospace constructions. Part 005:Homogeneous assemblies of heat resisting Ni or Co base alloys

实施日期：2009-12-01

BS EN 60512-12-2-2006

Steckverbinder fuer elektronische Einrichtungen. Mess-und Pruefverfahren. Pruefungen der Loetbarkeit. Pruefung 12b. Loetbarkeit,Loetkolbenverfahren Connectors for electronic equipment. Tests and measurements. Part 12-2:Soldering tests. Test 12b:Solderability,wetting,soldering iron method Connecteurs pour equipements electroniques. Essais et measures. Essais de soudure. Essai 12b. Soudabilte,mouillage,methode du fer a souder Corr 16987:March 30,2007

实施日期：2006-04-28

NF C93-120-2-1-2006

Fixed electric double-layer capacitors for use in electronic equipment - Part 2-1 : blank detail specification - Electric double layer capacitors for power application - Assessment level EZ.

DIN EN 60127-4-2009

微型熔断器 第4部分:通用模数熔断体(UMF) 通孔和表面安装型

Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types

实施日期：2009-07-01

DIN EN 60512-12-5-2006

电子设备用连接器 试验和测量 第12-5部分:锡焊试验 试验12e:耐锡焊热,烙铁法

Connectors for electronic equipment - Tests and measurements - Part 12-5: Soldering tests - Test 12e: Resistance to soldering heat, soldering iron method (IEC 60512-12-5:2006); German version EN 60512...

适用范围：The object of this part of IEC 60512 is to detail a standard test method to assess the ability of a connector to withstand the heating stresses produced by a soldering iron.

实施日期：2008-11-01

ISO 5179-1983

使用不同间距试件的可钎焊性研究

Investigation of brazeability using a varying gap test piece

适用范围：Specifies a testing method for assessing the influence of the various parameters which can influence brazing during manufacture as a function of clearances. The test piece described gives guidance abou...

发布日期：1983-10-01  实施日期：1983-10-01

EN 60068-2-20-2008

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads [Superseded: CENELEC HD 323.2.20 S3]

IEC 60749-21-2011

半导体器件 机械和气候试验方法 第21部分:可焊性

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

适用范围：IEC 60749-21:2011 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free ...

发布日期：2011-04-07  实施日期：2011-04-07

DIN EN 60691-2010

热熔断体 要求和应用指南

Thermal-links - Requirements and application guide

实施日期：2010-09-01

BS EN 60068-2-69-2007

环境试验规程.第2部分:试验方法.第69节:试验Te:润湿平衡法试验表面镶嵌技术用电子元件软钎焊

Umgebungseinflüsse. Prüfungen. Prüfung Te. Prüfung der L?tbarkeit von Bauelementen der Elektronik für Oberfl?chenmontage (SMD) mit der Benetzungswaage Environmental testing. Part 2-69:Tests. Test Te:So...

适用范围：This part of IEC 60068 outlines test Te, solder bath wetting balance method and solderglobule wetting balance method, applicable for surface mounting devices. These methodsdetermine quantitatively the ...

实施日期：2007-07-31