Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method
发布日期:2006-03-23 实施日期:2006-03-23
Rahmenspezifikation. Hockbelastbare Festwiderstaende Harmonized system of quality assessment for electronic components. Sectional specification:Fixed power resistors Specification intermediaire. Resist...
实施日期:1997-09-15
Investigation of brazeability using a varying gap test piece
发布日期:1983-10-01 实施日期:1983-10-01
Specifications for particular types of winding wires. Solderable polyesterimide enamelled round copper wire, class 180
实施日期:1993-04-15
Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method (IEC 60512-12-4:2006); German version EN 60512-12...
实施日期:2008-11-01
Electronic components. Electrical thermostatic switches for use in electronic equipments.
实施日期:1983-06-01
实施日期:1996-12-15
Leiterplatten. Starre Mehrlagen-Leiterplatten mit Durchverbindungen Rahmenspezifikation. Bauartspezifikation zum Nachweis der Befaehigung Anforderungsstufen A,B und C Printed Boards Part 4:Rigid Multil...
实施日期:1997-06-15
Integrated Electronic Circuits and Micro-Assemblies of Assessed Quality (Capability Approval Procedures):Generic Data and Methods of Test Incorporating Corrigendum No.1;CORR 10184;September 1998;
实施日期:1998-03-15
Fixed electric double-layer capacitors for use in electronic equipment - Part 2-1: Blank detail specification - Electric double-layer capacitors for power application - Assessment level EZ
发布日期:2006-04-10 实施日期:2006-04-10
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