NF C93-400-12-7-2002

Connectors for electronic equipment - Tests and measurements - Part 12-7 : Soldering tests - Test 12g : solderability, wetting balance method.

GB 5095.6-1986

电子设备用机电元件基本试验规程及测量方法 第六部分:气候试验和锡焊性试验

实施日期：1986-12-01

GB/T 2423.32-1985

电工电子产品基本环境试验规程 润湿称量法可焊性试验方法

Basic environmental testing procedures for electric and electronic products--Solderability testing by the wetting balance method

实施日期：1986-02-01

NF C20-700-2-69-2013

Environmental testing - Part 2-69 : tests - Test Te : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

NF C20-758-2005

环境试验.试验方法.试验Td:可焊性.表面装配电路元件的金属喷镀耐溶性和焊接耐热性

Environmental testing - Part 2-58 : tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD).

BS EN 60317-20-1996

特种绕组线规范.155级可焊接聚氨酯漆包圆铜线

Specifications for particular types of winding wires. Solderable polyurethane enamelled round copper wire, class 155

实施日期：1993-04-15

BS CECC 23800-801-1998

Bauartspezifikation zur Anerkennung der Befaehigung:flexible Mehrlagen-Leiterplatten mit Durchverbindungen Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification:Flexible Multilayer Printed Boards with Through Connections Specification particuliere d'Agrement:cartes imprimees multicouches souples avec connexions transversales

实施日期：1998-06-15

BS EN 140201-1997

电子元器件质量评定协调体系.空白详细规范.固定电源用电阻器(S 级评定)

Vordruck fuer Bauartspezifikation. Hochbelastbare Festwiderstaende (Bewertungsstufe S) Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification:Fixed Power Resistors...

实施日期：1997-09-15

BS EN 60068-2-44-1995

环境试验.第2部分:试验方法.第44节:试验T指南:锡焊

Umweltpruefungen. Pruefungen. Leitfaden fuer die Pruefungen T:Loeten Environmental Testing Part 2:Tests Guidance on Test T. Soldering (IEC 68-2-44:1995) (G) Essais d'environment. Essais. Guide pour l'e...

实施日期：1995-01-01

BS QC 160000-1-1987

Harmonized system of quality assessment for electronic components. Electrical relays. Generic specification: electromechanical all-or-nothing relays. Test and measurement procedures

BS EN 60068-2-54-2006

Umweltpruefungen. Pruefungen. Pruefung Ta:Pruefung der Loetbarkeit elektronischer Bauelemente mit der Benetzungswaage Environmental testing Part 2-54:Tests Test Ta:Solderability testing of electronic components by the wetting balance method Essais d'environnement. Essais. Essai Ta:Essai de brasabilite des composants electroniques par la methode de la balance de mouillage :1989

实施日期：2006-09-29

BS EN 60317-21-1996

特殊型绕组线规范.聚酰亚胺涂层的软钎焊聚酰胺酯漆包圆铜线.155类

Specifications for Particular Types of Winding Wires Part 21:Solderable Polyurethane Enamelled Round Copper Wire Overcoated with Polyamide,Class 155 IEC 317-21:1990;

实施日期：1996-01-01

BS EN 166100-1998

电子元器件质量评定协调系统.分规范:表面声波(SAW)滤波器

Rahmenspezifikation:Oberflaechenwellen (OFW) Filter Sectional Specification:Surface Acoustic Wave (SAW) Filters Specification intermediaire:filtres a ondes acoustiques de surface (OAS)

实施日期：1998-10-15

BS CECC 23700-801-1998

Bauartspezifikation zur Anerkennung der Befaehigung:starr-flexible doppelseitige Leiterplatten mit Durchverbindungen Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification:Flex-Rigid Double-Sided Printed Boards with Through Connections Specification particuliere d' Agrement:cartes imprimees double face flexorigides avec connexions transversales

实施日期：1998-06-15

IEC 60512-12-7-2001

电子设备用连接器 试验和测量 第12-7部分:锡焊试验 试验12g:湿平衡法的可焊性

Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method

发布日期：2001-01-24  实施日期：2001-01-24

BS EN 60603-1-2000

Connectors for frequencies below 3 MHz for use with printed boards. Generic specification. General requirements and guide for the preparation of detail specifications with assessed quality

实施日期：1993-07-15

BS EN 134000-1995

电子元器件质量评定协调体系.总规范:可变电容器(合格鉴定和性能鉴定)

Fachgrundspezifikation. Einstellbare Kondensatoren (Bauartanerkennung und Befaehigungsanerkennung) Harmonized System of Quality Assessment for Electronic Components General Specification Variable Capac...

实施日期：1995-01-01

EN 2591-501-2002

Aerospace series. Elements of electrical and optical connection. Test methods. Part 501:Soft solderability

实施日期：2002-06-01

BS EN 60603-2-1998

印制板用频率低于3MHz的连接器.共有固定特性的2,54mm(0,1in)基本网格的印制板用的评定质量的两部连接口详细规范

Steckverbinder fuer gedruckte Schaltungen fuer Frequenzen unter 3 MHz. Bauartspezifikation fuer guetebestaetigte indirekte Steckverbinder fuer gedruckte Schaltungen,Rastermass 2,54 mm (0,1 in),mit geme...

实施日期：1998-10-15

BS 9450-1975

Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures): generic data and methods of test