Basic environmental testing procedures for electric and electronic products--Solderability testing by the wetting balance method
实施日期:1986-02-01
Environmental testing - Part 2-58 : tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD).
Specifications for particular types of winding wires. Solderable polyurethane enamelled round copper wire, class 155
实施日期:1993-04-15
Vordruck fuer Bauartspezifikation. Hochbelastbare Festwiderstaende (Bewertungsstufe S) Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification:Fixed Power Resistors...
实施日期:1997-09-15
Umweltpruefungen. Pruefungen. Leitfaden fuer die Pruefungen T:Loeten Environmental Testing Part 2:Tests Guidance on Test T. Soldering (IEC 68-2-44:1995) (G) Essais d'environment. Essais. Guide pour l'e...
实施日期:1995-01-01
Specifications for Particular Types of Winding Wires Part 21:Solderable Polyurethane Enamelled Round Copper Wire Overcoated with Polyamide,Class 155 IEC 317-21:1990;
实施日期:1996-01-01
Rahmenspezifikation:Oberflaechenwellen (OFW) Filter Sectional Specification:Surface Acoustic Wave (SAW) Filters Specification intermediaire:filtres a ondes acoustiques de surface (OAS)
实施日期:1998-10-15
Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method
发布日期:2001-01-24 实施日期:2001-01-24
Fachgrundspezifikation. Einstellbare Kondensatoren (Bauartanerkennung und Befaehigungsanerkennung) Harmonized System of Quality Assessment for Electronic Components General Specification Variable Capac...
实施日期:1995-01-01
实施日期:2002-06-01
Steckverbinder fuer gedruckte Schaltungen fuer Frequenzen unter 3 MHz. Bauartspezifikation fuer guetebestaetigte indirekte Steckverbinder fuer gedruckte Schaltungen,Rastermass 2,54 mm (0,1 in),mit geme...
实施日期:1998-10-15
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