BS EN 60512-12-7-2001

电子设备连接器 试验和测量 第12-7部分:锡焊试验 试验12g:易焊性,润湿平衡方法 IEC 60512-12-7:2001

Steckverbinder fuer elektronische Einrichtungen. Mess-und Pruefverfahren. Pruefungen der Loetbarkeit. Pruefung 12g. Loetbarkeit,Loetwaage-Verfahren Connectors for Electronic Equipment-Tests and Measure...

适用范围：This part of IEC 60512, when required by the detail specification, is to be used for testing connectors within the scope of IEC technical committee 48. This test may also be used for similar components...

实施日期：2001-09-15

BS QC 030000-1993

Harmonized system of quality assessment for electronic components. Rectangular connectors for frequencies below 3 MHz. Generic specification. General requirements and guide for the preparation of detail specifications for connectors with assessed quality

BS EN 62326-4-1-1997

印制电路板.层间连接的硬性印制电路板.分规格.性能详细规格.A,B和C性能水平

Leiterplatten. Starre Mehrlagen-Leiterplatten mit Durchverbindungen Rahmenspezifikation. Bauartspezifikation zum Nachweis der Befaehigung Anforderungsstufen A,B und C Printed Boards Part 4:Rigid Multil...

适用范围：This Capability Detail Specification (Cap DS) is based on IEC 2326-4. It relates to rigid multilayer printed boards with interiayer connections manufactured with materials specified in 3.1. It specifie...

实施日期：1997-06-15

DIN EN 2591-501-2003

航空和航天 光电连接件 试验方法 第501部分:软焊性

Aerospace series - Elements of electrical and optical connection; test methods - Part 501: Soft solderability

适用范围：The document specifies methods of verifying the solderability of electrical male and female contacts to be soldered in elements of connection and of contacts with self-contained solder and flux not acc...

BS EN 140200-1997

电子元器件质量评定协调体系.分规范.固定电源用电阻器

Rahmenspezifikation. Hockbelastbare Festwiderstaende Harmonized system of quality assessment for electronic components. Sectional specification:Fixed power resistors Specification intermediaire. Resist...

适用范围：This sectional specification prescribes the preferred values for characteristics and ratings and also theinspection requirements for fixed power resistors of assessed quality having a rated dissipation...

实施日期：1997-09-15

BS EN 60603-1-2000

Connectors for frequencies below 3 MHz for use with printed boards. Generic specification. General requirements and guide for the preparation of detail specifications with assessed quality

实施日期：1993-07-15

BS EN 62326-4-1997

印制电路板.层间连接的硬性印制电路板.分规格

Leiterplatten. Starre Mehrlagen-Leiterplatten mit Durchverbindungen. Rahmenspezifikation Printed Boards Part 4:Rigid Multilayer Printed Boards with Interlayer Connections-Sectional Specification Cartes...

适用范围：This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. Thi...

实施日期：1997-06-15

BS EN 60068-2-58-2004

环境试验.试验方法.试验Td.软钎焊性、喷涂金属耐融化性和表面装配设备(SMD)耐焊接热的试验方法

Umweltpruefungen. Pruefungen. Pruefung Td. Pruefverfahren fuer Loetbarkeit,Widerstandsfaehigkeit gegenueber Aufloesen der Metallisierung und Loetwaermebestaendigkeit bei oberflaechenmontierbaren Bauele...

适用范围：This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys contai...

实施日期：2004-11-19

BS 6137-1982

锡铅合金的电镀层规范

Spezifikation fuer galvanische Ueberzuege von Zinn-Blei-Legierungen Specification for Electroplated Coatings of Tin/Lead Alloys Specification pour les depots electrolytiques d'alliages d'etain/plomb

适用范围：Essential and additional information to be supplied to the manufacturer, classification of service conditions and coatings. Appendices give guidance notes on use and test methods.

实施日期：1982-02-26

BS EN 134000-1995

电子元器件质量评定协调体系.总规范:可变电容器(合格鉴定和性能鉴定)

Fachgrundspezifikation. Einstellbare Kondensatoren (Bauartanerkennung und Befaehigungsanerkennung) Harmonized System of Quality Assessment for Electronic Components General Specification Variable Capac...

适用范围：This specification is applicable to variable capacitors of the following types for use in electronic equipment: (a) Variable tuning capacitors (b) Trimmer capacitors (c) Preset capacitors It establi...

实施日期：1995-01-01

BS QC 160000-1-1987

Harmonized system of quality assessment for electronic components. Electrical relays. Generic specification: electromechanical all-or-nothing relays. Test and measurement procedures

NF C20-700-2-69-2013

Environmental testing - Part 2-69 : tests - Test Te : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

EN 60512-12-7-2001

Connectors for Electronic Equipment - Tests and Measurements Part 12-7: Soldering Tests - Test 12g: Solderability, Wetting Balance Method IEC 60512-12-7: 2001; (E)

NF C93-400-12-7-2002

Connectors for electronic equipment - Tests and measurements - Part 12-7 : Soldering tests - Test 12g : solderability, wetting balance method.

IEC 60068-2-54-2006

基本环境试验规程 第2-54部分:试验 试验Ta:锡焊 润湿称量法可焊性试验

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

适用范围：IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testi...

发布日期：2006-04-27  实施日期：2006-04-27

DIN EN 60512-12-6-1996

电子设备用电子机械元件.基本试验程序和测量方法.第12部分:焊接试验.第6节:试验12f:机械焊接中耐流液和清洗溶剂的密封性

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in ma...

适用范围：The document specifies a standard test method to verify the effectiveness of the sealing of a component against flux and cleaning solvents during the machine soldering process. The result of this test ...

BS QC 760200-1997

Halbleiterbauelemente-Integrierte Schaltungen. Rahmenspezifikation fuer integrierte Schicht-und Hybridschaltungen auf Grundlage des Befaehigungsanerkennungsverfahrens Harmonized System of Quality Assessment for Electronic Components Semiconductor Devices-Integrated Circuits-Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures Dispositifs a semiconducteurs. Circuits integres. Specification intermediaire pour le

实施日期：1997-08-15

BS EN 1758-1998

铜及铜合金.以铅为框架的带材

Kupfer und Kupferlegierungen. Baender fuer Systemtraeger Copper and Copper Alloys-Strip for Lead Frames Cuivre et alliages de cuivre. Bandes pour grilles de composants CORR 10197:September 15,1998;

适用范围：This European Standard specifies the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with widths up to and including ...

实施日期：1998-05-15

BS EN 60317-20-1996

特种绕组线规范.155级可焊接聚氨酯漆包圆铜线

Specifications for particular types of winding wires. Solderable polyurethane enamelled round copper wire, class 155

适用范围：To be read in conjunction with BS EN 60317-0-1

实施日期：1993-04-15

BS EN 60317-23-1996

特种绕组线规范.180级可焊接聚酰胺酯漆包圆铜线

Specifications for particular types of winding wires. Solderable polyesterimide enamelled round copper wire, class 180

适用范围：To be read in conjunction with BS EN 60317-13

实施日期：1993-04-15