Steckverbinder fuer elektronische Einrichtungen. Mess-und Pruefverfahren. Pruefungen der Loetbarkeit. Pruefung 12g. Loetbarkeit,Loetwaage-Verfahren Connectors for Electronic Equipment-Tests and Measure...
适用范围:This part of IEC 60512, when required by the detail specification, is to be used for testing connectors within the scope of IEC technical committee 48. This test may also be used for similar components...
实施日期:2001-09-15
Leiterplatten. Starre Mehrlagen-Leiterplatten mit Durchverbindungen Rahmenspezifikation. Bauartspezifikation zum Nachweis der Befaehigung Anforderungsstufen A,B und C Printed Boards Part 4:Rigid Multil...
适用范围:This Capability Detail Specification (Cap DS) is based on IEC 2326-4. It relates to rigid multilayer printed boards with interiayer connections manufactured with materials specified in 3.1. It specifie...
实施日期:1997-06-15
Aerospace series - Elements of electrical and optical connection; test methods - Part 501: Soft solderability
适用范围:The document specifies methods of verifying the solderability of electrical male and female contacts to be soldered in elements of connection and of contacts with self-contained solder and flux not acc...
Rahmenspezifikation. Hockbelastbare Festwiderstaende Harmonized system of quality assessment for electronic components. Sectional specification:Fixed power resistors Specification intermediaire. Resist...
适用范围:This sectional specification prescribes the preferred values for characteristics and ratings and also theinspection requirements for fixed power resistors of assessed quality having a rated dissipation...
实施日期:1997-09-15
Leiterplatten. Starre Mehrlagen-Leiterplatten mit Durchverbindungen. Rahmenspezifikation Printed Boards Part 4:Rigid Multilayer Printed Boards with Interlayer Connections-Sectional Specification Cartes...
适用范围:This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. Thi...
实施日期:1997-06-15
Umweltpruefungen. Pruefungen. Pruefung Td. Pruefverfahren fuer Loetbarkeit,Widerstandsfaehigkeit gegenueber Aufloesen der Metallisierung und Loetwaermebestaendigkeit bei oberflaechenmontierbaren Bauele...
适用范围:This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys contai...
实施日期:2004-11-19
Spezifikation fuer galvanische Ueberzuege von Zinn-Blei-Legierungen Specification for Electroplated Coatings of Tin/Lead Alloys Specification pour les depots electrolytiques d'alliages d'etain/plomb
适用范围:Essential and additional information to be supplied to the manufacturer, classification of service conditions and coatings. Appendices give guidance notes on use and test methods.
实施日期:1982-02-26
Fachgrundspezifikation. Einstellbare Kondensatoren (Bauartanerkennung und Befaehigungsanerkennung) Harmonized System of Quality Assessment for Electronic Components General Specification Variable Capac...
适用范围:This specification is applicable to variable capacitors of the following types for use in electronic equipment: (a) Variable tuning capacitors (b) Trimmer capacitors (c) Preset capacitors It establi...
实施日期:1995-01-01
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
适用范围:IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testi...
发布日期:2006-04-27 实施日期:2006-04-27
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in ma...
适用范围:The document specifies a standard test method to verify the effectiveness of the sealing of a component against flux and cleaning solvents during the machine soldering process. The result of this test ...
Kupfer und Kupferlegierungen. Baender fuer Systemtraeger Copper and Copper Alloys-Strip for Lead Frames Cuivre et alliages de cuivre. Bandes pour grilles de composants CORR 10197:September 15,1998;
适用范围:This European Standard specifies the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with widths up to and including ...
实施日期:1998-05-15
Specifications for particular types of winding wires. Solderable polyurethane enamelled round copper wire, class 155
适用范围:To be read in conjunction with BS EN 60317-0-1
实施日期:1993-04-15
Specifications for particular types of winding wires. Solderable polyesterimide enamelled round copper wire, class 180
适用范围:To be read in conjunction with BS EN 60317-13
实施日期:1993-04-15
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