EN ISO 18279-2003

Brazing. Imperfections in brazed joints ISO 18279:2003

实施日期：2003-08-01

ASME B16.50-2013

锻造铜和铜合金铜焊接压力配件

Wrought Copper and Copper Alloy Braze-Joint Pressure Fittings

实施日期：2013-08-06

DIN 65169-1986

航空和宇航; 硬焊和高温焊接物件; 设计原则

Aerospace; brazed and high-temperature brazed components; directions for design

适用范围：This standard applies to the design of brazed and high-temperature brazed metallic components for aerospace use.; To achieve brazings of high quality and high component safety, a number of factors has ...

EN 14612-2003

Space product assurance Verification and approval of automatic machine wave soldering

实施日期：2003-08-01

EN 62137-1-1-2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

DIN EN 62137-1-3-2009

表面安装技术 表面安装焊缝的环境和耐久性试验方法 第1-3部分:循环坠落试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

实施日期：2009-07-01

DIN EN 61188-5-3-2008

印制电路板和印制电路板组件 设计和使用 第5-3部分:连接(连接面/接头)考虑事项 两侧带有鸥翼形引线的元件

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

实施日期：2008-07-01

IEC 60512-12-4-2006

电子设备用连接器 试验和测量 第12-4部分:锡焊试验 试验12d:耐锡焊热,焊料槽法

Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method

适用范围：Details a standard test method to assess the ability of a connector to withstand the heating stresses produced by a mass soldering operation.

发布日期：2006-02-13  实施日期：2006-02-13

IEC 60512-12-1-2006

电子设备用连接器 试验和测量 第12-1部分:锡焊试验 试验12a:湿焊料槽法的可焊性

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method

适用范围：Details a standard test method to assess the solderability of the terminations of a connector designed for use with printed boards or for other applications using similar soldering techniques.

发布日期：2006-03-23  实施日期：2006-03-23

NF C93-711-5-2-2004

Printed boards and printed board assemblies - Design and use - Part 5-2 : attachment (land/joint) considerations - Discrete components.

DIN EN 14324-2004

硬钎焊 硬钎焊接头的应用导则

Brazing - Guidance on the application of brazed joints

适用范围：To give guidance on the application of brazing. To give an introduction to brazing and a basis for the understanding and use of brazing in different applications.

BS EN 1012-1-2010

压缩机和真空泵.安全要求.压缩机

Kompressoren und Vakuumpumpen. Sicherheitsanforderungen. Kompressoren Compressors and vacuum pumps. Safety requirements Part 1:Air compressors Compresseurs et pompes. vide. Prescriptions de sécurit Com...

适用范围：This part of EN 1012 is applicable to compressors and compressor units having an operating pressure greaterthan 0,5 bar and designed to compress air, nitrogen or inert gases. This document deals with a...

实施日期：2010-10-31

EN 60512-12-4-2006

Connectors for electronic equipment - Tests and measurements Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method IEC 60512-12-4:2006

NF C93-704-2005

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN.

DIN EN 60512-12-1-2006

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006); German version EN 60512-12-1:2006

实施日期：2006-11-01

IEC 61188-5-2-2003

印制电路板和印制电路板组件 设计和使用 第5-2部分:连接(连接面/接头)考虑事项 分立元件

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

适用范围：Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ...

发布日期：2003-06-24  实施日期：2003-06-24

EN 4632-005-2009

Aerospace series. Weldability and brazeability of materials in aerospace constructions. Part 005:Homogeneous assemblies of heat resisting Ni or Co base alloys

实施日期：2009-12-01

DIN EN 60749-25-2004

半导体器件 机械和气候试验方法 第25部分:温度循环

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

适用范围：This part of DIN EN 60749 provides a test procedure for determining the ability of smiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating hi...

实施日期：2004-04-01

BS EN 61188-5-8-2008

Leiterplatten und Elektronikaufbauten auf Leiterplatten. Konstruktion und Anwendung. Sektionale Anforderungen. Betrachtungen zur Montage (Landefl?che/Verbindung). Fl?chenmatrix-Bauelemente (BGA, FBGA,CGA,LGA) Printed boards and printed board assemblies. Design and use. Part 5-8:Attachment (land/joint) considerations. Area array components (BGA,FBGA,CGA,LGA) Cartes imprimées et cartes imprimées équipées. Conception et utilisation. Considérations sur les liaisons pistes-soudures. Composants matric

实施日期：2008-05-30

DIN EN 62137-1-1-2008

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

实施日期：2008-02-01