实施日期:2009-02-01
Environmental testing - Part 2: Tests; guidance on test T: Soldering (IEC 60068-2-44:1995); German version EN 60068-2-44:1995
适用范围:In the present guide the necessary general consideration are development for, on the one hand, the correct application of the test of IEC 68-2-20, 68-2-54, IEC 68-2-58 in component specifications both ...
Welding and allied processes -- Assemblies made with soft solders and brazing filler metals -- Mechanical test methods
适用范围:Defines the principles and the technique of the tests designed to determine the conventional mechanical characteristics of assemblies produced with soft solders and brazing filler metals. Specifies als...
发布日期:1985-04-01 实施日期:1985-04-01
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
实施日期:2009-08-01
Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method
适用范围:Details a standard test method to assess the solderability of the terminations of a connector that are designed to be soldered with a soldering iron and the soldering bath test method of IEC 60512-12-1...
发布日期:2006-02-13 实施日期:2006-02-13
Leiterplatten und Flachbaugruppen. Konstruktion und Anwendung. Betrachtungen zur Montage (Anschlussflaeche/Verbindung). Einzelbauelemente Printed boards and printed board assemblies Design and use Part...
适用范围:This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components. The purpose of this standard is to provide the appropriate size...
实施日期:2003-10-16
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
适用范围:This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components.
实施日期:2004-05-01
Tabular layouts of article characteristics for solder lugs, solder pins, soldering terminals
适用范围:Tabular layouts of article characteristics for solder lugs, solder pins, soldering terminalsGrille de description pour caractéristiques des objets des cosses à souder, baguettes de soudure, plots à fou...
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
实施日期:2008-07-01
Workmanship requirements for soldered electronic assemblies - Part 1: General
适用范围:This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates.
实施日期:2003-11-01
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
适用范围:The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints ...
发布日期:2009-01-26 实施日期:2009-01-26
Rack and panel connectors, trapezoidal, round contacts <Durchmesser> 1 mm; dimensions of type A; solder termination for free wiring
Wrought Copper and Copper Alloy Braze-Joint Pressure Fittings
适用范围:This Standard establishes requirements for wrought copper and wrought copper alloy braze joint seamless fittings designed for use with seamless copper tube conforming to ASTM Standard Specification, B ...
Brazing - Non-destructive examination of brazed joints; German version EN 12799:2000
适用范围:The document describes non-destructive test procedures and test piece types necessary to perform the test on brazed joints.
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