DIN EN 61192-3-2003

钎焊组件的加工要求 第3部分:插孔安装件

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

适用范围：This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surfac...

实施日期：2003-10-01

BS EN 61192-3-2003

焊接电子组件的工艺要求 第2部分:穿孔安装组件

Anforderungen an die Ausfuehrungsqualitaet von Loetbaugruppen. Baugruppen in Durchsteckmontage Workmanship requirements for soldered electronic assemblies Part 3:Through-hole mount assemblies Exigences...

适用范围：This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surfac...

实施日期：2003-04-07

EN 61192-3-2003

Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies IEC 61192-3:2002

NF C90-710-3-2010

Surface mounting technology - Part 3 : standard method for the specification of components for Through Hole Reflow (THR) soldering.

NF C90-730-3-2003

Workmanship requirements for soldered electronic assemblies - Part 3 : through-hole mount assemblies.

IEC 61760-3-2010

表面安装技术 第3部分:通过洞孔回流焊接元件的规范标准方法

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

适用范围：IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in t...

发布日期：2010-03-16  实施日期：2010-03-16

BS EN 61188-7-2009

Leiterplatten und Flachbaugruppen. Konstruktion und Anwendung. Nullorientierung elektronischer Bauelemente für CAD-Bibliotheksaufbau Printed boards and printed board assemblies. Design and use. Part 7:Electronic component zero orientation for CAD library construction Cartes imprimées et cartes imprimées équipées. Conception et utilisation. Orientation nulle des composants électroniques pour l'élaboration de la bibliothèque CAO

实施日期：2009-09-30

BS EN 61760-3-2010

Oberfl?chenmontagetechnik. Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzl?ten (THR) Surface mounting technology Part 3:Standard method for the specification of components for Through Hole Reflow (THR) soldering Technique du montage en surface. Méthode normalisée relative. la spécification des composants pour le brasage par refusion. trous traversants (THR,through hole reflow)

实施日期：2010-06-30

NF C96-022-15-2003

Semiconductor devices - Mechanical and climatic test methods - Part 15 : resistance to soldering temperature for through-hole mounted devices.