IEC 62566-2012

核电站 仪器仪表和操作安全至关重要 HDL编程集成电路开发的系统执行A类功能

Nuclear power plants - Instrumentation and control important to safety - Development of HDL-programmed integrated circuits for systems performing category A functions

发布日期：2012-01-26  实施日期：2012-01-26

BS EN 62137-4-2014

Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices

发布日期：2015-02-28  实施日期：2015-02-28

NF C96-034-2-2011

Semiconductor die products - Part 2 : exchange data formats.

ASTM F744M-2010

测量数字集成电路剂量率阈值的试验方法（米制）

Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric)

实施日期：2010-05-01

BS EN 60749-7-2011

Halbleiterbauelemente. Mechanische und klimatische Prüfverfahren. Messung des inneren Feuchtegehaltes und Analyse von anderen Restgasen Semiconductor devices. Mechanical and climatic test methods. Part 7:Internal moisture content measurement and the analysis of other residual gases Dispositifs. semiconducteurs. Méthodes d'essais mécaniques et climatiques. Mesure de la teneur en humiditinterne et analyse des autres gaz résiduels

实施日期：2011-09-30

BS EN 60749-26-2014

半导体器件 机械和气候试验方法 静电放电(ESD)灵敏度测试 人体模型(HBM)

Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)

发布日期：2014-06-30  实施日期：2014-06-30

ISO/IEC 14443-1-2016

Identification cards -- Contactless integrated circuit cards -- Proximity cards -- Part 1: Physical characteristics

发布日期：2016-03-01  实施日期：2016-03-01

IEC/PAS 60747-17-2011

半导体器件 分立元件 第17部分:基本和增强隔离用磁性和电容耦合器

Semiconductor devices. Discrete devices. Part 17:Magnetic and capacitive coupler for basic and reinforced isolation

实施日期：2011-11-17

ISO/IEC 14443-2-2010

识别卡 无接触点集成电路卡 感应卡 第2部分:射频功率和信号接口

Identification cards -- Contactless integrated circuit cards -- Proximity cards -- Part 2: Radio frequency power and signal interface

发布日期：2010-09-01  实施日期：2010-09-01

NF C96-070-2-2013

EMC IC modelling - Part 2 : models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

ISO/IEC 14443-2-2016

Identification cards -- Contactless integrated circuit cards -- Proximity cards -- Part 2: Radio frequency power and signal interface

发布日期：2016-07-01  实施日期：2016-07-01

IEC/TS 62686-1-2015

Process management for avionics. Electronic components for aerospace,defence and high performance (ADHP) applications . Part 1:General requirements for high reliability integrated circuits and discrete semiconductors

发布日期：2015-04-22  实施日期：2015-04-22

IEC 60747-6-2016

Semiconductor devices - Part 6: Discrete devices - Thyristors

发布日期：2016-04-13  实施日期：2016-04-13

BS ISO/IEC 14443-3-2011+A1-2011

Identification cards. Contactless intergrated circuit cards. Proximity cards. Part 3:Initialization and anticollision AMD:February 29,2012

实施日期：2011-01-01

BS PD IEC/TS 61967-3-2014

集成电路 150kHz-1GHz电磁辐射的测量 放射形辐射测量 表面扫描法?

Integrated circuits. Measurement of electromagnetic emissions. Measurement of radiated emissions. Surface scan method

发布日期：2014-09-30  实施日期：2014-09-30

BS EN 60191-6-22-2013

半导体器件的器械标准化:表面安装半导体器件封装外形图绘制的一般规则

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Sili...

发布日期：2013-04-30  实施日期：2013-04-30

ISO/IEC 14443-1 AMD 1-2012

Identification cards - Contactless integrated circuit cards - Proximity cards - Part 1: Physical characteristics AMENDMENT 1: Additional PICC classes - Second Edition

发布日期：2012-05-01  实施日期：2012-05-01

DIN EN 62007-1-2016

Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics (IEC 62007-1:2015); German version EN 62007-1:2015

发布日期：2016-03-01  实施日期：2016-03-01

ISO/IEC 14443-2 AMD 1-2011

Identification cards - Contactless integrated circuit cards - Proximity cards - Part 2: Radio frequency power and signal interface AMENDMENT 1: Limits of electromagnetic disturbance levels parasitically generated by the PICC - Second Edition

发布日期：2011-10-15  实施日期：2011-10-15

NF C93-013-4-2014

Packaging of components for automatic handling - Part 4 : stick magazines for electronic components encapsulated in packages of different forms