DIN EN 61249-2-39-2013

印制板和其他互连结构用材料 第2-39部分：包层和非包层增强基材 无铅装配用阻燃型铜包高性能环氧化物和非环氧化物编织的E玻璃层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of def...

发布日期：2013-09-01  实施日期：2013-09-01

DIN EN 61249-2-42-2010

印制板和其他互连结构用材料 第2-42部分:包层和非包层增强基材 无铅装配用阻燃型铜包环氧溴化物非编织/编织的E玻璃增强层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of def...

实施日期：2010-12-01

IEC 61249-2-43-2016

Materials for printed boards and other interconnecting structures – Part 2-43: Reinforced base materials clad and unclad – Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly - Edition 1.0

发布日期：2016-05-01  实施日期：2016-05-01

IEC 61191-2-2013

印制电路板组件 第2部分:分规范 表面安装焊接组件的要求

Printed board assemblies. Part 2:Sectional specification. Requirements for surface mount soldered assemblies

发布日期：2013-06-05  实施日期：2013-06-05

EN 61249-4-14-2009

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

DIN IEC/TS 62647-1-2013

航空电子设备的工艺管理 包括无铅焊锡的航空航天和国防电子系统 第1部分：无铅控制计划的编制

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan (IEC/TS 62647-1:2012)

发布日期：2013-07-01  实施日期：2013-07-01

IEC 62137-4-2014

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

发布日期：2014-10-09  实施日期：2014-10-09

EN 61249-4-15-2009

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

DIN EN 60749-21-2012

半导体器件 机械和气候试验方法 第21部分：可焊性

Semiconductor devices. Mechanical and climatic test methods. Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011

EN 61249-2-42-2010

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

NF C93-780-2-36-2009

Materials for printed boards and other interconnecting structures - Part 2-36 : reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad for lead-free assembly.

DIN EN 228-2014

汽车燃料 无铅汽油 要求和试验方法

Automotive fuels - Unleaded petrol - Requirements and test methods; German version

发布日期：2014-10-01  实施日期：2014-10-01

EN 61249-4-17-2009

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

DIN EN 61249-4-16-2009

印制板和其他互连结构用材料 第4-16部分:非包层预浸渍材料的分规范集（用于多层板制造） 无铅组件用阻燃型多功能非卤化环氧化物编织的E玻璃预浸渍材料（垂直燃烧试验）

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non...

实施日期：2009-12-01

DIN EN 1601-2014

液体矿物油 碳氢化合物的检验 气相色谱分析氧化物和氧含量 氧专用挥测器方法

Liquid petroleum products - Unleaded petrol - Determination of organic oxygenate compounds and total organically bound oxygen content by gas chromatography (O-FID); German version

发布日期：2014-07-01  实施日期：2014-07-01

IEC/PAS 62647-23-2011

航空电子设备的进程管理 无铅焊锡的航空航天和国防电子系统 第23部分:解决无铅电子和混合程序集的返工和修复指导

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Part 23:Rework and repair guidance to address the implications of lead-free electronics and mixed ...

发布日期：2011-07-28  实施日期：2011-07-01

EN 61249-4-16-2009

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC/TR 60068-3-12-2014

环境试验 第3-12部分:支持文件和指南 评估可能发生的无铅焊料回流温度曲线方法

Environmental testing. Part 3-12:Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

发布日期：2014-10-17  实施日期：2014-10-17

DIN EN 61249-4-14-2009

印制板和其他互连结构用材料 第4-14部分:非包层预浸渍材料的分规范集（用于多层板制造） 无铅组件用阻燃型环氧化物编织的E玻璃预浸渍材料（垂直燃烧试验）

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-gla...

实施日期：2009-12-01

DIN EN 61249-4-15-2009

印制板和其他互连结构用材料 第4-15部分:非包层预浸渍材料的分规范集（用于多层板制造） 无铅组件用阻燃型多功能环氧化物编织的E玻璃预浸渍材料（垂直燃烧试验）

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epo...

实施日期：2009-12-01