IEC 62047-14-2012

半导体装置 微电机装置 第14部分:金属薄膜材料的成形极限测量方法

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

适用范围：IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described her...

发布日期：2012-02-28  实施日期：2012-02-28

ISO 24631-6-2011

动物的射频识别 第6部分:动物识别信息的表示(视觉显示/数据传输)

Radiofrequency identification of animals -- Part 6: Representation of animal identification information (visual display/data transfer)

适用范围：ISO 24631-6:2011 specifies the representation of the animal identification information specified in ISO 11784 and ISO 11785 on a transceiver display and its communication from transceivers to systems i...

发布日期：2011-09-01  实施日期：2011-09-01

DIN EN 62047-9-2012

半导体器件 微电机器件 第9部分：微电机系统用晶片与晶片粘结强度的测量

Semiconductor devices. Micro-electromechanical devices. Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011

NF C96-070-2-2013

EMC IC modelling - Part 2 : models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

NF U05-004-6-2011

Radiofrequency identification of animals - Part 6 : representation of animal identification information (visual display/data transfer).

IEC 62047-9-2011

半导体器件 微电机器件 第9部分:微电子机械系统上用干胶片封的晶片粘合强度测试

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

适用范围：IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and a...

发布日期：2011-07-13  实施日期：2011-07-13

IEC 62047-16-2015

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

发布日期：2015-03-05  实施日期：2015-03-05

BS EN 62047-9-2011

半导体器件 微机电装置 MEMS的晶圆与晶圆结合强度测量

Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS

发布日期：2013-01-31  实施日期：2013-01-31

IEC/TS 62878-2-4-2015

Device embedded substrate. Part 2-4:Guidelines. Test element groups (TEG)

发布日期：2015-03-27  实施日期：2015-03-27

IEC 62878-1-1-2015

Device embedded substrate - Part 1-1: Generic specification - Test methods

发布日期：2015-05-20  实施日期：2015-05-20

NF C96-050-4-2011

Semiconductor devices - Micro-electromechanical devices - Part 4 : generic specifications for MEMS.

NF E29-692-2-2001

Gas cylinders - Gas cylinder valve connections for use in the microelectronics industry - Part 2 : specification and type testing for valve to cylinder connections.

IEC 62433-4-2016

EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)

发布日期：2016-05-25  实施日期：2016-05-25

DIN EN 62047-4-2011

Semiconductor devices. Micro-electromechanical devices. Part 4:Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010

IEC 62047-25-2016

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

发布日期：2016-08-29  实施日期：2016-08-29

IEC 62047-10-2011

半导体器件 微电机器件 第10部分:MEMS材料的微柱压缩试验

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

适用范围：IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The ...

发布日期：2011-07-26  实施日期：2011-07-26

ASTM F677-2013

Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications

实施日期：2013-04-01

IEC 62047-21-2014

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson''s ratio of thin film MEMS materials

发布日期：2014-06-19  实施日期：2014-06-19

BS EN 62047-10-2011

Halbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Druckprüfverfahren an zylinderf?rmigen Mikroproben für Werkstoffe der Mikrosystemtechnik Semiconductor devices. Micro-electromechanical devices Part 10:Micro-pillar compression test for MEMS materials Dispositifs. semiconducteur. Dispositifs microélectromécaniques. Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS

实施日期：2011-09-30

ISO 15639-1-2015

Radio frequency identification of animals -- Standardization of injection sites for different animal species -- Part 1: Companion animals (cats and dogs)

发布日期：2015-07-01  实施日期：2015-07-01