BS EN 62047-11-2013

半导体装置 微机电设备 独立材料材料的微机电系统线性热膨胀系数测定方法

Semiconductor devices. Micro-electromechanical devicesTest method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

发布日期：2013-10-31  实施日期：2013-10-31

ASTM F677-2013

Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications

实施日期：2013-04-01

IEC 62047-21-2014

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson''s ratio of thin film MEMS materials

发布日期：2014-06-19  实施日期：2014-06-19

ISO 15639-1-2015

Radio frequency identification of animals -- Standardization of injection sites for different animal species -- Part 1: Companion animals (cats and dogs)

发布日期：2015-07-01  实施日期：2015-07-01

IEC/TS 62878-2-4-2015

Device embedded substrate. Part 2-4:Guidelines. Test element groups (TEG)

发布日期：2015-03-27  实施日期：2015-03-27

NF C96-050-4-2011

Semiconductor devices - Micro-electromechanical devices - Part 4 : generic specifications for MEMS.

EN 62047-6-2010

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

IEC 62047-25-2016

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

发布日期：2016-08-29  实施日期：2016-08-29

DIN EN 62047-4-2011

Semiconductor devices. Micro-electromechanical devices. Part 4:Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010

IEC 62878-1-1-2015

Device embedded substrate - Part 1-1: Generic specification - Test methods

发布日期：2015-05-20  实施日期：2015-05-20

DIN EN 62047-10-2012

半导体器件 微电机器件 第1部分：微电机系统材料的微柱压缩试验

Semiconductor devices. Micro-electromechanical devices. Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011

IEC 62047-10-2011

半导体器件 微电机器件 第10部分:MEMS材料的微柱压缩试验

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

适用范围：IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The ...

发布日期：2011-07-26  实施日期：2011-07-26

IEC 62433-4-2016

EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)

发布日期：2016-05-25  实施日期：2016-05-25

NF E29-692-2-2001

Gas cylinders - Gas cylinder valve connections for use in the microelectronics industry - Part 2 : specification and type testing for valve to cylinder connections.

IEC 62047-16-2015

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

发布日期：2015-03-05  实施日期：2015-03-05

BS EN 62047-9-2011

半导体器件 微机电装置 MEMS的晶圆与晶圆结合强度测量

Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS

发布日期：2013-01-31  实施日期：2013-01-31

ISO 24631-5-2014

Radio frequency identification of animals -- Part 5: Procedure for testing the capability of RFID transceivers of reading ISO 11784 and ISO 11785 transponders

发布日期：2014-12-01  实施日期：2014-12-01

IEC 62047-17-2015

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

发布日期：2015-03-05  实施日期：2015-03-05

DIN EN 62047-9-2012

半导体器件 微电机器件 第9部分：微电机系统用晶片与晶片粘结强度的测量

Semiconductor devices. Micro-electromechanical devices. Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011

IEC/TR 61967-1-1-2015

集成电路 电磁辐射测量 第1-1部分:通用条件和定义 近场扫描数据交换格式

Integrated circuits. Measurement of electromagnetic emissions. Part 1-1:General conditions and definitions. Near-field scan data exchange format

适用范围：This part of IEC 61967 provides guidance for exchanging data generated by near-field scan measurements. The described exchange format could also be used for near-field scan data generated by simulation...

发布日期：2015-08-28  实施日期：2015-08-28