BS EN 62047-12-2011

Semiconductor devices. Micro-electromechanical devices. Part 12:Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

实施日期：2011-11-30

DIN EN 62007-1-2016

Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics (IEC 62007-1:2015); German version EN 62007-1:2015

发布日期：2016-03-01  实施日期：2016-03-01

ISO/IEC/IEEE 60559-2011

信息技术 微处理系统 浮点计算法

Information technology -- Microprocessor Systems -- Floating-Point arithmetic

发布日期：2011-06-01  实施日期：2011-06-01

IEC 62047-16-2015

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

发布日期：2015-03-05  实施日期：2015-03-05

NF C96-013-6-20-2011

Mechanical standardization of semiconductor devices - Part 6-20 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small o

NF C93-801-2-2009

Semiconductor optoelectronic devices for fibre optic system applications - Part 2 : measuring methods.

BS EN 61954-2011

Static VAR compensators (SVC). Testing of thyristor valves Static VAR compensators (SVC). Testing of thyristor valves Compensateurs statiques de puissance réactive (SVC). Essais des valves. thyristors

实施日期：2011-07-31

DIN EN 62418-2010

半导体器件 金属化应力空隙试验

Semiconductor devices - Metallization stress void test (IEC 62418:2010); German version EN 62418:2010

实施日期：2010-12-01

ISO 14706-2014

表面化学分析.用全反射X射线荧光光谱法测定硅圆片表面主要污物

Surface chemical analysis -- Determination of surface elemental contamination on silicon wafers by total-reflection X-ray fluorescence (TXRF) spectroscopy

发布日期：2014-08-01  实施日期：2014-08-01

DIN EN 62417-2010

半导体器件 金属氧化物半导体场效应晶体管的可移动离子试验

Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010); German version EN 62417:2010

实施日期：2010-12-01

BS EN 60191-4-2014

半导体器件机械标准化 半导体器件封装外壳形状编码系统和分类

Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages

实施日期：2014-03-31

IEC 61803 AMD 2-2016

AMENDMENT 2 Determination of power losses in high-voltage direct current (HVDC) converter stations with line commutated converters - Edition 1.0

发布日期：2016-05-01  实施日期：2016-05-01

NF C96-050-7-2011

Semiconductor devices - Micro-electromechanical devices - Part 7 : MEMS BAW filter and duplexer for radio frequency control and selection.

IEC 61747-3-1-2015

Liquid crystal display devices - Part 3-1: Liquid crystal display (LCD) cells - Blank detail specification

发布日期：2015-04-09  实施日期：2015-04-09

EN 60700-1-2015

Thyristor valves for high voltage direct current (HVDC) power transmission - Part 1: Electrical testing

发布日期：2015-09-25  实施日期：2015-09-25

IEC 60749-40-2011

半导体器件 机械和气候试验方法 第40部分:使用应变计的板级跌落试验方法

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

发布日期：2011-07-13  实施日期：2011-07-13

DIN EN 60191-6-20-2011

Mechanical standardization of semiconductor devices. Part 6-20:General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 601

ASTM F1467-1999(2005)e1

半导体装置和微电路电离辐射效应测试用X射线试验仪(大约10 keV光子)的使用指南

Standard Guide for Use of an X-Ray Tester ([approximate]10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits

IEC 62149-1-2011

光纤有源元件和器件 性能标准 第1部分:总则和指南

Fibre optic active components and devices - Performance standards - Part 1: General and guidance

发布日期：2011-12-07  实施日期：2011-12-07

BS EN 62047-20-2014

半导体装置 微机电设备 陀螺仪

Semiconductor devices. Micro-electromechanical devices. Gyroscopes

发布日期：2014-10-31  实施日期：2014-10-31