IEC 62047-9-2011

半导体器件 微电机器件 第9部分:微电子机械系统上用干胶片封的晶片粘合强度测试

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

发布日期：2011-07-13  实施日期：2011-07-13

IEC 62047-25-2016

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

发布日期：2016-08-29  实施日期：2016-08-29

EN 61800-2-2015

Adjustable speed electrical power drive systems - Part 2: General requirements - Rating specifications for low voltage adjustable speed a.c. power drive systems

发布日期：2015-09-25  实施日期：2015-09-25

DIN EN 60191-6-22-2013

半导体器件的机械标准化 第6-22部分：表面安装半导体器件封装外形图绘制的一般规则 半导体封装硅细间距球栅阵列和硅细间距基板栅格阵列(S-FBGA和S-FLGA)的设计指南

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic

发布日期：2013-08-01  实施日期：2013-08-01

BS EN 62047-26-2016

Semiconductor devices — Micro-electromechanical devices Part 26: Description and measurement methods for micro trench and needle structures

发布日期：2016-05-31  实施日期：2016-05-31

BS EN 62747-2014

高压直流输电(HVDC )系统用电压源转换器(VSC)的术语

Terminology for voltage-sourced converters (VSC) for high-voltage direct current (HVDC) systems

发布日期：2014-10-31  实施日期：2014-10-31

NF C93-547-10-1-2014

Liquid crystal display devices - Part 10-1 : environmental, endurance and mechanical test methods - Mechanical

DIN EN 61954-2012

静态无功功率补偿器(SVC) 晶闸管阀的试验

Static VAR compensators (SVC). Testing of thyristor valves (IEC 61954:2011); German version EN 61954:2011

BS EN 62047-1-2016

Semiconductor devices Micro-electromechanical devices Part 1: Terms and definitions

发布日期：2016-04-30  实施日期：2016-04-30

BS ISO 15632-2012

Microbeam analysis. Selected instrumental performance parameters for the specification and checking of energy-dispersive X-ray spectrometers for use in electron probe microanalysis

发布日期：2012-08-31  实施日期：2012-08-31

DIN EN 62258-2-2011

半导体模产品 第2部分：交换数据格式

Semiconductor die products. Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011

EN 61800-7-301-2016

Adjustable speed electrical power drive systems - Part 7-301: Generic interface and use of profiles for power drive systems - Mapping of profile type 1 to network technologies

发布日期：2016-02-12  实施日期：2016-02-12

NF C86-010/A1-1988

NF C 86-010-1986补充件1

BS EN 62040-4-2013

不间断电源系统(UPS) 环境因素 必要条件和报告

Uninterruptible power systems (UPS). Environmental aspects. Requirements and reporting

发布日期：2013-10-31  实施日期：2013-10-31

DIN EN 60191-6-21-2011

Mechanical standardization of semiconductor devices. Part 6-21:General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21

DIN EN 60749-30-2011

半导体器件 机械和气候试验方法 第3部分：可靠性试验前不气密的表面安装器件的预调

Semiconductor devices. Mechanical and climatic test methods. Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011); German version EN 60749-30:2005 + A1:2011

BS PD CLC/TR 62258-4-2013

半导体压模产品 第4部分:压模用户和供应商调查表

Semiconductor die products. Questionnaire for die users and suppliers

发布日期：2014-11-30  实施日期：2014-11-30

DIN EN 62415-2010

半导体器件 恒流电迁移试验

Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010

实施日期：2010-12-01

BS EN 62047-11-2013

半导体装置 微机电设备 独立材料材料的微机电系统线性热膨胀系数测定方法

Semiconductor devices. Micro-electromechanical devicesTest method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

发布日期：2013-10-31  实施日期：2013-10-31

ASTM F1892-2012

Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices

实施日期：2012-07-01