ISO/IEC/IEEE 15289-2011

系统和软件工程 系统和软件寿命过程信息产品的内容(记录文件)

Systems and software engineering -- Content of life-cycle information products (documentation)

发布日期：2011-11-01  实施日期：2011-11-01

ISO/IEC TR 29110-5-1-2-2011

软件工程 极小项目(VSE)的生存周期轮廓 第5-1-2部分:管理和工程指南:类属轮廓组:基本轮廓

Software engineering -- Lifecycle profiles for Very Small Entities (VSEs) -- Part 5-1-2: Management and engineering guide: Generic profile group: Basic profile

发布日期：2011-05-01  实施日期：2011-05-01

ISO/IEC TR 29110-1-2011

软件工程 对于非常小型实体(VSEs)的生命周期配置文件 第1部分:概述

Software engineering -- Lifecycle profiles for Very Small Entities (VSEs) -- Part 1: Overview

发布日期：2011-09-01  实施日期：2011-09-01

DIN EN 62047-7-2012

半导体器件 微电机器件 第7部分：射频控制与选择用MEMS BAW滤波器和双工器

Semiconductor devices. Micro-electromechanical devices. Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011

IEC 62047-12-2011

半导体器件 微电机器件 第12部分:用微电机系统结构谐振进行薄膜材料的弯曲疲劳试验方法

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

发布日期：2011-09-13  实施日期：2011-09-13

NF C90-410-5-3-2011

General requirements for Home and Building Electronic Systems (HBES) and Building Automation and Control Systems (BACS) - Part 5-3 : EMC requirements for HBES/BACS used in industry environment.

ISO/IEC 15026-3-2015

Systems and software engineering -- Systems and software assurance -- Part 3: System integrity levels

发布日期：2015-12-01  实施日期：2015-12-01

BS EN 62047-10-2011

Halbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Druckprüfverfahren an zylinderf?rmigen Mikroproben für Werkstoffe der Mikrosystemtechnik Semiconductor devices. Micro-electromechanical devices Part 10:Micro-pillar compression test for MEMS materials Dispositifs. semiconducteur. Dispositifs microélectromécaniques. Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS

实施日期：2011-09-30

ISO/IEC/IEEE 26531-2015

Systems and software engineering -- Content management for product life-cycle, user and service management documentation

发布日期：2015-05-01  实施日期：2015-05-01

BS EN 62047-12-2011

Semiconductor devices. Micro-electromechanical devices. Part 12:Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

实施日期：2011-11-30

IEC 62741-2015

Demonstration of dependability requirements - The dependability case

发布日期：2015-02-17  实施日期：2015-02-17

BS ISO/IEC 15940-2013

系统和软件工程 软件工程环境服务

Systems and software engineering. Software Engineering Environment Services

发布日期：2013-04-30  实施日期：2013-04-30

IEC 62047-16-2015

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

发布日期：2015-03-05  实施日期：2015-03-05

NF C96-050-7-2011

Semiconductor devices - Micro-electromechanical devices - Part 7 : MEMS BAW filter and duplexer for radio frequency control and selection.

ISO/IEC TS 30103-2015

Software and Systems Engineering -- Lifecycle Processes -- Framework for Product Quality Achievement

发布日期：2015-09-01  实施日期：2015-09-01

IEC 62047-9-2011

半导体器件 微电机器件 第9部分:微电子机械系统上用干胶片封的晶片粘合强度测试

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

发布日期：2011-07-13  实施日期：2011-07-13

NF C61-105/A2-2009

Switches for household and similar fixed electrical installations - Collateral standard - Switches and related accessories for use in home and building electronic systems (HBES).

BS ISO/IEC IEEE 24765-2011

System und Software-Engineering. Begriffe Systems and software engineering. vocabulary Ingénierie des systèmes et du logiciel. Vocabulaire

实施日期：2011-05-31

EN 50090-4-3-2015

Home and building electronic systems (hbes). Part 4-3:media independent layers. Communication over ip (en 13321-2)

发布日期：2015-06-01  实施日期：2015-06-01

BS EN 62047-11-2013

半导体装置 微机电设备 独立材料材料的微机电系统线性热膨胀系数测定方法

Semiconductor devices. Micro-electromechanical devicesTest method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

发布日期：2013-10-31  实施日期：2013-10-31