BS EN 62047-11-2013

半导体装置 微机电设备 独立材料材料的微机电系统线性热膨胀系数测定方法

Semiconductor devices. Micro-electromechanical devicesTest method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

发布日期：2013-10-31  实施日期：2013-10-31

EN 62047-6-2010

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

ASTM E606/E606M-2012

Standard Test Method for Strain-Controlled Fatigue Testing

DIN EN 62047-10-2012

半导体器件 微电机器件 第1部分：微电机系统材料的微柱压缩试验

Semiconductor devices. Micro-electromechanical devices. Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011

IEC 62047-10-2011

半导体器件 微电机器件 第10部分:MEMS材料的微柱压缩试验

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

适用范围：IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The ...

发布日期：2011-07-26  实施日期：2011-07-26

IEC 62034-2012

电池供电的应急逃生照明设备用自动测试系统

Automatic test systems for battery powered emergency escape lighting

适用范围：IEC 62034:2012 specifies the basic performance and safety requirements for individual products and components that are incorporated into automatic test systems for use with emergency lighting systems o...

发布日期：2012-02-22  实施日期：2012-02-22

ISO 20242-3-2011

工业自动化系统与集成 测试应用的服务接口 第3部分:虚拟设备服务接口

Industrial automation systems and integration. Service interface for testing applications. Part 3:Virtual device service interface

适用范围：ISO 20242-3:2011 defines a service interface for the communication with virtual devices comprising capabilities of software modules and physical devices, accessed via resource management services as de...

实施日期：2011-12-09

BS EN 62047-12-2011

Semiconductor devices. Micro-electromechanical devices. Part 12:Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

实施日期：2011-11-30

ISO 20242-4-2011

工业自动化系统与集成 测试应用的服务接口 第4部分:设备能力概况模板

Industrial automation systems and integration. Service interface for testing applications. Part 4:Device capability profile template

适用范围：ISO 20242-4:2011 defines the formatting, syntax and semantic rules for describing ■device and coordinator capabilities with XML schema, and ■the configuration of devices with XML.

实施日期：2011-12-06

NF C96-050-12-2012

Semiconductor devices - Micro-electromechanical devices - Part 12 : bending fatigue testing method of thin film materials using resonant vibration of MEMS structures.

NF M08-007-1996

Liquid hydrocarbons. Dynamic measurement. Proving systems for volumetric meters. Part 2 : pipe provers.

BS EN 62034-2012

Automatic test systems for battery powered emergency escape lighting

发布日期：2012-06-30  实施日期：2012-06-30

DIN EN 62047-6-2010

半导体器件 微电机器件 第6部分:薄膜材料的轴向疲劳试验方法

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010

实施日期：2010-07-01

IEC 62047-12-2011

半导体器件 微电机器件 第12部分:用微电机系统结构谐振进行薄膜材料的弯曲疲劳试验方法

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

适用范围：IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard ...

发布日期：2011-09-13  实施日期：2011-09-13

BS EN 62047-10-2011

Halbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Druckprüfverfahren an zylinderf?rmigen Mikroproben für Werkstoffe der Mikrosystemtechnik Semiconductor devices. Micro-electromechanical devices Part 10:Micro-pillar compression test for MEMS materials Dispositifs. semiconducteur. Dispositifs microélectromécaniques. Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS

实施日期：2011-09-30

NF C96-050-6-2010

Semiconductor devices - Micro-electromechanical devices - Part 6 : axial fatigue testing methods of thin film materials.

IEC 62047-22-2014

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

发布日期：2014-06-19  实施日期：2014-06-19

DIN 77400-2015

Cleaning services - School buildings - Requirements for the cleaning

发布日期：2015-09-01  实施日期：2015-09-01