BS EN 62047-11-2013

半导体装置 微机电设备 独立材料材料的微机电系统线性热膨胀系数测定方法

Semiconductor devices. Micro-electromechanical devicesTest method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

发布日期：2013-10-31  实施日期：2013-10-31

IEC 62047-21-2014

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson''s ratio of thin film MEMS materials

发布日期：2014-06-19  实施日期：2014-06-19

NF C96-050-4-2011

Semiconductor devices - Micro-electromechanical devices - Part 4 : generic specifications for MEMS.

EN 62047-6-2010

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

DIN EN 62047-4-2011

Semiconductor devices. Micro-electromechanical devices. Part 4:Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010

DIN EN 62047-10-2012

半导体器件 微电机器件 第1部分：微电机系统材料的微柱压缩试验

Semiconductor devices. Micro-electromechanical devices. Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011

IEC 62047-10-2011

半导体器件 微电机器件 第10部分:MEMS材料的微柱压缩试验

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

适用范围：IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The ...

发布日期：2011-07-26  实施日期：2011-07-26

IEC 62047-17-2015

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

发布日期：2015-03-05  实施日期：2015-03-05

BS EN 62047-12-2011

Semiconductor devices. Micro-electromechanical devices. Part 12:Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

实施日期：2011-11-30

IEC/TS 62607-4-3-2015

纳米制造 关键控制特性 第4-3部分:纳米电能存储 纳米材料的联系和涂层电阻率测量

Nanomanufacturing. Key control characteristics. Part 4-3:Nano-enabled electrical energy storage. Contact and coating resistivity measurements for nanomaterials

适用范围：This part of IEC 62607 provides a standardized test method for the measurement of contact and coating resistivity of nano-enabled electrode materials. This method will enable a customer to: a) decide w...

实施日期：2015-08-18

NF C96-050-12-2012

Semiconductor devices - Micro-electromechanical devices - Part 12 : bending fatigue testing method of thin film materials using resonant vibration of MEMS structures.

ISO/TTA 4-2002

硅基质上薄膜导热性的测量

Measurement of thermal conductivity of thin films on silicon substrates

适用范围：TTA 4:2002 proposes a standard procedure for the three-omega method for measuring the thermal conductivity of a thin, electrically insulating film, on a substrate having a thermal conductivity signific...

发布日期：2002-11-01  实施日期：2002-11-01

IEC 62716-2013

Photovoltaic (PV) modules - Ammonia corrosion testing

发布日期：2013-06-27  实施日期：2013-06-27

IEC 62047-14-2012

半导体装置 微电机装置 第14部分:金属薄膜材料的成形极限测量方法

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

适用范围：IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described her...

发布日期：2012-02-28  实施日期：2012-02-28

DIN EN 62047-6-2010

半导体器件 微电机器件 第6部分:薄膜材料的轴向疲劳试验方法

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010

实施日期：2010-07-01

IEC 62047-12-2011

半导体器件 微电机器件 第12部分:用微电机系统结构谐振进行薄膜材料的弯曲疲劳试验方法

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

适用范围：IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard ...

发布日期：2011-09-13  实施日期：2011-09-13

UL 61646-2012

UL Standard for Safety Thin-Film Terrestrial Photovoltaic (PV) Modules ?Design Qualification and Type Approval First Edition

实施日期：2012-01-25

BS EN 62047-8-2011

Halbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Streifen-Biege-Prüfverfahren zur Messung von Zugbeanspruchungsmerkmalen dünner Schichten Semiconductor devices. Micro-electromechanical devices Part 8:Strip bending test method for tensile property measurement of thin films Dispositifs. semiconducteurs. Dispositifs microélectromécaniques. Méthode d'essai de la flexion de bandes en vue de la mesure des propriétés de traction des couches minces

实施日期：2011-06-30

DIN EN 62047-8-2011

半导体器件 微电机器件 第8部分：测量薄膜拉伸性能的带弯曲试验方法

Semiconductor devices. Micro-electromechanical devices. Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011

BS EN 62047-10-2011

Halbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Druckprüfverfahren an zylinderf?rmigen Mikroproben für Werkstoffe der Mikrosystemtechnik Semiconductor devices. Micro-electromechanical devices Part 10:Micro-pillar compression test for MEMS materials Dispositifs. semiconducteur. Dispositifs microélectromécaniques. Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS

实施日期：2011-09-30